 | | LX2160XE72232B | NXP Semiconductors | IC MPU QORLQ 2.2GHZ 1517FCPBGA | Microprocessors | 1517-FCPBGA (40x40) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit Graphics Acceleration: Yes USB: USB 3.0 (2) + PHY (2) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40×40) | 124 | |
 | | LX2160XN71826B | NXP Semiconductors | IC MPU QORLQ 1.8GHZ 1517FCPBGA | Microprocessors | 1517-FCPBGA (40x40) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit Graphics Acceleration: Yes USB: USB 3.0 (2) + PHY (2) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40×40) | 512 | |
 | | LX2160XN72029B | NXP Semiconductors | IC MPU QORLQ LX2 2GHZ 1517FCPBGA | Microprocessors | 1517-FCPBGA (40x40) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit Graphics Acceleration: Yes USB: USB 3.0 (2) + PHY (2) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40×40) | 1,052 | |
| N/A | | LX2160XN72232B | NXP Semiconductors | IC MPU QORLQ 2.2GHZ 1517FCPBGA | Microprocessors | 1517-FCPBGA (40x40) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 SDRAM Graphics Acceleration: Yes USB: USB 3.0 (2) + PHY (2) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40×40) | 200 | |
| N/A | N/A | LX2162RC82029B | NXP Semiconductors | IC MPU QORIQ LX 2GHZ 1150FBGA | Microprocessors | 1150-FBGA (23x23) | N/A | 5°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4, SDRAM Operating Temperature: 5°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1150-FBGA (23×23) | 68 | |
| N/A | | LX2162RE82029B | NXP Semiconductors | IC MPU QORIQ LX 2GHZ 1150FBGA | Microprocessors | 1150-FBGA (23x23) | N/A | 5°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4, SDRAM Operating Temperature: 5°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1150-FBGA (23×23) | 407 | |
| N/A | | LX2162RN82029B | NXP Semiconductors | IC MPU QORIQ LX 2GHZ 1150FBGA | Microprocessors | 1150-FBGA (23x23) | N/A | 5°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4, SDRAM Operating Temperature: 5°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1150-FBGA (23×23) | 1,769 | |
 | | LX4F230H5QRFIGB0 | Texas Instruments | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 427 | |
 | | LX4F231H5QRFIGA3 | Texas Instruments | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,524 | |
 | | LX4F231H5QRFIGB0 | Texas Instruments | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,505 | |
 | | LX4F232H5BBFIGB0 | Texas Instruments | IC MCU 32BIT 256KB FLASH 157BGA | Microcontrollers | 157-BGA Microstar Junior (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 157-BGA Microstar Junior (9×9) | 1,008 | |
 | | LX4F232H5QCFIGA3 | Texas Instruments | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,259 | |
 | | LX4F232H5QCFIGB0 | Texas Instruments | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 552 | |
 | | LX4F232H5QDFIGA3 | Texas Instruments | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.63V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 109 | |
| N/A | N/A | M0L1304QDGS20RQ1 | Texas Instruments | AUTOMOTIVE 32-MHZ ARM CORTEX-M0+ | Microcontrollers | 20-VSSOP | 1.62V - 3.6V | -40°C – 125°C | Core Processor: ARM® Cortex®-M0+ Program Memory Size: 16KB (16K x 8) Mounting Type: Surface Mount | 582 | |
| N/A | N/A | M0L1304QDGS28RQ1 | Texas Instruments | AUTOMOTIVE 32-MHZ ARM CORTEX-M0+ | Microcontrollers | 28-VSSOP | 1.62V - 3.6V | -40°C – 125°C | Core Processor: ARM® Cortex®-M0+ Program Memory Size: 16KB (16K x 8) Mounting Type: Surface Mount | 64 | |
| N/A | | M0L1304QDYYRQ1 | Texas Instruments | AUTOMOTIVE 32-MHZ ARM CORTEX-M0+ | Microcontrollers | 16-SOT-23-THIN | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 6x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-SOT-23-THIN Package / Case: SOT-23-16 Thin, SOT-23 Variant | 1,030 | |
| N/A | | M0L1304QRGERQ1 | Texas Instruments | AUTOMOTIVE 32-MHZ ARM CORTEX-M0+ | Microcontrollers | 24-VQFN (4x4) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 24-VQFN (4×4) Package / Case: 24-VFQFN Exposed Pad | 782 | |
 | | M0L1304QRHBRQ1 | Texas Instruments | AUTOMOTIVE 32-MHZ ARM CORTEX-M0+ | Microcontrollers | 32-VQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 10x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 32-VQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 604 | |
| N/A | N/A | M0L1305QDGS20RQ1 | Texas Instruments | AUTOMOTIVE 32-MHZ ARM CORTEX-M0+ | Microcontrollers | 20-VSSOP | 1.62V - 3.6V | -40°C – 125°C | Core Processor: ARM® Cortex®-M0+ Program Memory Size: 32KB (32K x 8) Mounting Type: Surface Mount | 1,474 | |