LX2160XN72232B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 2.2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 888 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2160X |
| Manufacturer | NXP Semiconductors |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 0 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 16 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 SDRAM | REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2.2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2160XN72232B – IC MPU QORLQ 2.2GHZ 1517FCPBGA
The LX2160XN72232B is a high-performance microprocessor IC from NXP Semiconductors based on the ARM® Cortex®-A72 architecture. It integrates a 16-core, 64-bit processing cluster running at 2.2 GHz and is packaged in a 1517-FCPBGA (40×40) surface-mount package.
Designed for embedded and industrial applications, the device combines multi-core compute capability with high-bandwidth I/O and onboard security features to address networking, storage, and edge compute use cases where performance and industrial qualification are required.
Key Features
- Core ARM® Cortex®-A72 architecture with 16 cores running at 2.2 GHz for parallel compute throughput in multi-threaded embedded workloads.
- Memory Support DDR4 SDRAM controllers for modern memory interfaces and system memory bandwidth.
- Networking Two 100 Gbps Ethernet interfaces to support high-bandwidth networking and data plane applications.
- Storage and USB Four SATA 3.0 ports plus two USB 3.0 interfaces with PHY support for high-performance storage and peripheral connectivity.
- Security Secure Boot and TrustZone® provide hardware-backed security primitives for system integrity and trusted execution.
- Graphics Acceleration Integrated graphics acceleration capability to assist with display or graphics offload tasks.
- Additional Interfaces CANbus support for control and vehicle/industrial fieldbus integration.
- Package & Mounting 1517-FCPBGA (40×40) supplier device package, surface-mount for board-level integration.
- Operating Range & Qualification Industrial qualification with an operating temperature range of -40°C to 105°C suitable for harsh environments.
Typical Applications
- Industrial Networking Use the dual 100 Gbps Ethernet interfaces and industrial qualification to build high-throughput network appliances and switches.
- Storage Systems Leverage four SATA 3.0 ports and USB 3.0 connectivity for NAS, SAN, and storage gateway platforms.
- Edge Compute Platforms Deploy the 16-core Cortex‑A72 cluster for compute-intensive edge services and data processing at the network edge.
- Embedded Controllers & Gateways Integrate CANbus, robust I/O and security features for industrial gateways and control systems requiring long-term reliability.
Unique Advantages
- Scaleable Multi-Core Performance: Sixteen 64-bit ARM® Cortex®‑A72 cores at 2.2 GHz provide parallel processing capacity for demanding embedded workloads.
- High-Bandwidth Network I/O: Two 100 Gbps Ethernet interfaces enable designs that require substantial networking throughput.
- Integrated Storage Connectivity: Four SATA 3.0 ports and USB 3.0 plus PHY support reduce the need for additional bridging components in storage-focused designs.
- Hardware Security Primitives: Secure Boot and TrustZone® support system integrity and trusted execution environments for secure embedded deployments.
- Industrial Temperature and Qualification: -40°C to 105°C operating range and industrial qualification make the device suitable for harsh-environment installations.
- Compact Surface-Mount Package: The 1517-FCPBGA (40×40) package simplifies board-level integration in space-constrained systems.
Why Choose LX2160XN72232B?
The LX2160XN72232B positions itself as a robust, high-performance embedded processor option for industrial and embedded system designers. With a 16-core ARM® Cortex®-A72 CPU cluster, extensive I/O including dual 100 Gbps Ethernet and multiple storage interfaces, and built-in security features, it addresses demanding networking, storage, and edge compute tasks while supporting industrial operating conditions.
Built by NXP Semiconductors and packaged for surface-mount assembly, the LX2160XN72232B delivers an integrated platform that helps designers reduce BOM complexity, meet industrial temperature ranges, and deploy secure, high-throughput systems for long-term applications.
Request a quote or submit a pricing inquiry referencing part number LX2160XN72232B to begin specification or procurement discussions.

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