LX2162RE82029B

The LX2162RE82029B from NXP Semiconductors is a QorIQ LX-series embedded microprocessor featuring up to sixteen ARM® Cortex®-A72 cores running at 2.0 GHz in a 64-bit implementation. It integrates high-performance packet, memory and I/O subsystems to address demanding embedded use cases.

Designed for embedded networking, communications and storage applications, the device emphasizes multi-core processing, high-speed SerDes and rich peripheral integration to deliver performance, throughput and system-level integration for infrastructure and edge platforms.

Key Features

• Core & Cache — Sixteen ARM® Cortex®-A72 cores, single-threaded, up to 2.0 GHz with 48 KB L1 instruction and 32 KB L1 data caches per core; an 8 MB L3 cache with ECC and On-Chip Memory (OCM) mode.
• Memory Subsystem — One 72-bit (64-bit + ECC) DDR4 SDRAM memory controller supporting 2.9 GT/s; supports DDR4 and SDRAM memory types.
• Datapath Acceleration (DPAA2) — Integrated DPAA2 including packet parsing/classification, queue and buffer management, SEC cryptography acceleration (up to 50 Gbps), decompression/compression acceleration (DCE) up to 88 Gbps, QDMA engine and a 2 MB Packet Express Buffer.
• High-Speed I/O — Twelve SerDes lanes up to 25 Gbps and three PCIe Gen3 controllers (x8, x4, x4) for flexible high-bandwidth connectivity.
• Ethernet Support — Interfaces supporting IEEE 1588, up to 14 Ethernet MACs and multiple PHY interface standards including USXGMII, SGMII, XFI/SFI and 50G/25G/40G PHY modes.
• Storage & USB — Four SATA 6 Gbps ports and one USB 3.0 controller with integrated PHY for external storage and host interfaces.
• Peripheral Integration — Multiple peripheral controllers including two SD host controllers, two CAN modules (optionally supporting Flexible Datarate), FlexSPI, three SPI controllers, eight I2C controllers, four UARTs and up to 101 GPIOs.
• Security & Virtualization — QorIQ platform trust architecture 3.0 with 256 KB on-chip RAM for trusted accesses, support for hardware virtualization and partitioning enforcement (Arm MMU-500), and a global interrupt controller (Arm GIC-500).
• Debug & System Management — Debug support for run control, data acquisition, high-speed trace and performance/event monitoring; support for Voltage ID (VID) for yield improvement.
• Package & Temperature — 1150-ball FBGA package (23 × 23 mm) optimized for surface-mount mounting; operating temperature range 5 °C to 105 °C.

Typical Applications

• Networking & Communications Equipment — Multi-core processing, DPAA2 packet acceleration and up to 14 Ethernet MACs make the device suitable for routers, switches and network appliances.
• Storage and Data Infrastructure — Integrated SATA 6 Gbps ports, PCIe Gen3 controllers and DMA/queue acceleration support storage controllers and converged infrastructure nodes.
• Security and Virtualized Platforms — On-chip trust architecture, hardware virtualization support and cryptography acceleration enable secure partitioning and accelerated data-plane security functions.
• Industrial and Edge Systems — Rich peripheral set including CAN, multiple SPI/I2C/UART ports and a wide operating temperature range support embedded industrial and edge use cases.

Unique Advantages

• High Multi-Core Throughput: Sixteen ARM® Cortex®-A72 cores at up to 2.0 GHz provide compute headroom for parallel workloads and data-plane processing.
• Integrated Packet Acceleration: DPAA2 offloads packet parsing, classification and buffer management to reduce software overhead and improve throughput.
• Robust I/O Fabric: Twelve SerDes lanes, multiple PCIe Gen3 ports and extensive Ethernet PHY support simplify high-bandwidth system integration.
• Storage and Host Interfaces: Four SATA 6 Gbps ports and USB 3.0 with integrated PHY provide native connectivity for storage and host devices.
• Security and Isolation: On-chip trusted RAM and hardware virtualization/partitioning enforcement enable secure, isolated subsystems within a single device.
• System-Level Reliability: ECC-protected L3 cache and ECC-capable DDR4 interface support data integrity for mission-critical applications.

Why Choose LX2162RE82029B?

The LX2162RE82029B positions itself as a highly integrated embedded microprocessor combining multi-core ARM® Cortex®-A72 performance with a datapath-optimized acceleration architecture, extensive high-speed I/O and comprehensive peripheral integration. It is suited to designers building networking, storage, security and industrial edge systems that require combined compute, packet-processing and I/O capabilities in a single device.

With ECC-protected caches, DDR4 support, on-chip trusted RAM and hardware virtualization features, the LX2162RE82029B offers a scalable platform for long-term deployments where throughput, integration and system-level reliability are key considerations.

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