LX2162RC82029B

The LX2162RC82029B is an NXP Semiconductors QorIQ LX series microprocessor featuring ARM® Cortex®-A72 cores running at 2 GHz. This 64-bit, 16-core device provides multi-core, high-performance processing in a compact 1150‑FBGA (23×23) surface-mount package for embedded applications.

On-chip integration includes DDR4/SDRAM memory controllers and a range of I/O options such as SATA 6Gbps ports, USB 3.0 connectivity and CANbus support, making it suitable for embedded designs that require concurrent processing and multiple storage and communications interfaces.

Key Features

• CPU Core — ARM® Cortex®-A72 architecture with 16 cores at 2 GHz delivering 64‑bit multi‑core processing for parallel workloads.
• Memory Support — Integrated DDR4 and SDRAM controllers to support system memory requirements for embedded operating environments.
• Storage Interfaces — Four SATA 6Gbps ports (SATA 6Gbps (4)) for high-speed storage connectivity and direct-attached storage designs.
• Peripheral Connectivity — One USB 3.0 port and CANbus interface for peripheral and industrial network integration.
• Package & Mounting — 1150‑FBGA supplier device package (23×23) in a surface-mount form factor for board-level integration.
• Operating Temperature Range — Rated for operation from 5 °C to 105 °C to meet ambient requirements in a range of embedded environments.
• Environmental Compliance — RoHS compliant to support regulatory requirements for lead‑free assemblies.
• Graphics — No graphics acceleration included, focusing device resources on compute and I/O functions.

Typical Applications

• Embedded Systems — Multi-core 64-bit processing and DDR4 support for complex embedded software stacks and real-time tasks.
• Storage Appliances — Four SATA 6Gbps ports enable use in compact storage controllers and RAID-capable appliances.
• Industrial Control & Networking — CANbus connectivity and broad operating temperature range support industrial network nodes and control systems.
• Connectivity Gateways — USB 3.0 and multiple I/O options for gateway devices that aggregate data and manage peripherals.

Unique Advantages

• High core density: Sixteen ARM® Cortex®-A72 cores at 2 GHz provide parallel processing headroom for multi-threaded embedded workloads.
• Integrated memory interfaces: DDR4 and SDRAM controllers reduce external component count and simplify memory subsystem design.
• Multiple high-speed storage ports: Four SATA 6Gbps ports enable direct connection to multiple storage devices without additional controllers.
• Industrial I/O support: CANbus interface and USB 3.0 provide flexible connectivity for industrial and peripheral integration.
• Compact surface-mount package: 1150‑FBGA (23×23) package supports high-density board layouts while maintaining robust solderable form factor.
• Regulatory readiness: RoHS compliance supports lead‑free assembly requirements.

Why Choose LX2162RC82029B?

The LX2162RC82029B combines 16 ARM® Cortex®-A72 cores, integrated DDR4/SDRAM controllers and extensive storage and I/O options in a single 1150‑FBGA surface-mount device. Its mix of compute density and on-chip interfaces helps reduce external component count while addressing demanding embedded processing and connectivity needs.

This part is well suited to engineers designing embedded platforms that require scalable multi-core performance alongside multiple SATA ports, USB 3.0, and CANbus support. Its operating temperature range and RoHS compliance contribute to reliable, manufacturable designs for long-term deployment.

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