LX2160XE72232B

The LX2160XE72232B is a QorIQ Layerscape microprocessor featuring 16 ARM® Cortex®‑A72 64‑bit cores running up to 2.2 GHz in a 1517‑FCPBGA (40×40) package. Designed for embedded and industrial applications, it provides high compute density combined with extensive I/O and hardware acceleration to address demanding networking, storage and security use cases.

With multi‑level caches, dual DDR4 memory controllers with ECC, integrated packet and crypto acceleration, and industrial qualification, this device targets high‑performance embedded systems that require packet processing, storage connectivity and secure boot capabilities.

Key Features

• CPU Core — Sixteen ARM® Cortex®‑A72 64‑bit cores, single‑threaded, up to 2.2 GHz with per‑core L1 caches (48 KB instruction / 32 KB data) and an 8 MB L2 cache for the 16‑core LX2160A device.
• System Cache & Fabric — Cache coherent interconnect fabric up to 1500 MHz with an 8 MB Level‑3 cache offering ECC and on‑chip memory (OCM) mode.
• Memory — Two 72‑bit (64‑bit + ECC) DDR4 SDRAM controllers supporting 3.2 GT/s operation and ECC for system memory reliability.
• Packet & Data Acceleration (DPAA2) — Integrated datapath acceleration architecture providing packet parsing, classification, queue and buffer management, cryptography acceleration up to 50 Gbps, and compression/decompression acceleration up to 100 Gbps.
• High‑speed SerDes & Ethernet — 24 SerDes lanes up to 25 Gbps and Ethernet subsystem supporting up to 18 MACs with IEEE 1588 support and high‑speed interfaces including CAUI4 (100G), 50G, 25G, 40G and 10G options.
• PCIe, SATA, USB — Two PCIe Gen3 x8 controllers (SR‑IOV capable), four PCIe Gen3 x4 controllers, four SATA 3.0 controllers and two USB 3.0 controllers with integrated PHY.
• Peripheral Set — CANbus support, FlexSPI and SPI controllers, eight I2C controllers, four UARTs and GPIOs for broad peripheral connectivity.
• Security & Virtualization — Secure Boot and Arm TrustZone® support, QorIQ Platform Trust Architecture (PTA) with on‑chip RAM, hardware cryptography acceleration, and support for hardware virtualization with Arm MMU‑500.
• Reliability & Management — Integrated management complex (MC), on‑chip packet express buffer, global interrupt controller (Arm GIC‑500), secure and non‑secure watchdog timers, and ECC on caches and memory paths.
• Package & Temperature — 1517‑FCPBGA (40×40) surface‑mount package; industrial operating temperature range from −40 °C to 105 °C. RoHS compliant.

Typical Applications

• High‑Performance Networking — Packet processing, routing and switching platforms that benefit from the device’s multi‑core CPU, DPAA2 packet acceleration and high‑speed Ethernet interfaces.
• Telecom & Datacom Infrastructure — Applications requiring 100G/50G/25G physical interfaces, IEEE 1588 timing support and robust SerDes connectivity for line‑rate communications.
• Storage Systems — NAS and storage controllers leveraging multiple SATA 3.0 controllers, high memory bandwidth and hardware offloads for data movement.
• Industrial Control & Automation — Industrial‑qualified designs that require extended temperature operation, CANbus connectivity and deterministic packet handling.
• Security Appliances — Network security and VPN appliances that utilize Secure Boot, TrustZone® and on‑chip cryptographic acceleration for protected, high‑throughput processing.

Unique Advantages

• High compute density: Sixteen Cortex‑A72 cores at up to 2.2 GHz deliver parallel processing headroom for multi‑threaded embedded workloads.
• Integrated packet and crypto acceleration: DPAA2 and dedicated SEC/DCE engines offload packet parsing, crypto and compression tasks to free CPU cycles for application logic.
• Broad high‑speed I/O: Multiple PCIe controllers, 24 SerDes lanes, multi‑rate Ethernet MAC support and SATA/USB make the device a flexible system hub for connectivity‑intensive designs.
• Memory reliability: Dual 72‑bit DDR4 controllers with ECC and multi‑level caches with ECC increase system robustness for long‑running embedded systems.
• Security‑aware platform: Secure Boot, TrustZone® and on‑chip trusted RAM enable hardware‑anchored security suitable for secure networking and industrial applications.
• Industrial temperature and package: Surface‑mount 1517‑FCPBGA package and −40 °C to 105 °C qualification support deployment in industrial environments.

Why Choose LX2160XE72232B?

The LX2160XE72232B combines multi‑core Cortex‑A72 performance with a comprehensive set of hardware accelerators and high‑speed interfaces to address demanding embedded networking, storage and security applications. Its integration of DDR4 ECC, multi‑level caching, and DPAA2 packet/crypto offloads reduces system complexity while delivering predictable performance for data‑centric workloads.

This device is well suited for engineers building industrial and embedded systems that require high throughput, hardware security features and a wide range of peripheral connectivity in a single, industrial‑rated package.

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