LX2160XN71826B

The LX2160XN71826B is an NXP Layerscape QorlQ microprocessor IC based on 16 Arm® Cortex®-A72 64-bit cores running at 1.8 GHz. It targets compute‑intensive embedded and networking applications, delivering high integration for packet processing, security offload, and edge/industrial processing while maintaining a compact FCPBGA footprint.

Designed for systems requiring high throughput and robust I/O, this device combines multi‑core compute with accelerated security, compression, and a broad set of interfaces to simplify board design and reduce external component needs.

Key Features

• Core & Architecture Sixteen 64‑bit Arm® Cortex®‑A72 CPU cores clocked at 1.8 GHz, providing parallel compute for control and data‑plane tasks.
• Memory & Caching Dual DDR4 controllers with ECC support and on‑chip caching; datasheet references up to 2 × DDR4 72b and a 16 MB cache plus a 2 MB packet caching buffer to reduce external memory traffic.
• Security & Acceleration Integrated secure boot and Arm TrustZone® security features, plus hardware accelerators cited for up to 50 Gbit/s security offload and 100 Gbit/s compression/decompression.
• High‑Speed Connectivity Dual 100 Gbit/s Ethernet capability and a 122 Gbit/s Layer‑2 switch architecture, with up to 16 supported Ethernet ports for dense network interfaces.
• SerDes & PCIe High‑speed SerDes lane support (24 lanes up to 25 GHz) and up to 24 PCIe Gen3 lanes supporting multiple ports, enabling flexible host and NIC connectivity.
• Storage & Peripherals Four SATA 3.0 ports, two USB 3.0 ports (plus two USB PHYs), SD/eMMC, DUART, I2C and CAN interfaces for broad peripheral support.
• Package & Mounting 1517‑FCPBGA (40 × 40 mm) FCBGA package for surface‑mount applications, suitable for compact embedded designs.
• Operating Range & Compliance Industrial qualification with operating temperature from −40 °C to 105 °C and RoHS compliance for environmental compatibility.
• Graphics & Offload Graphics acceleration supported and dedicated engines for packet and data handling to offload host cores.

Typical Applications

• Network Appliances: Control and data‑plane processing, including switches and routers that require high Ethernet throughput and hardware offload.
• White‑Box Switching / Edge Compute: Host virtualization and edge processing with dense I/O, leveraging integrated MACs, PCIe, and packet caching.
• Data Center Offload: Acceleration of IPsec, compression, and other compute‑intensive networking functions to reduce host CPU load.
• 5G Packet Processing: Packet throughput and security/compression offload in distributed unit and central unit applications.
• Industrial Edge Systems: Embedded control and connectivity hubs that benefit from broad peripheral interfaces, extended temperature range, and ECC DDR4 memory support.

Unique Advantages

• Highly integrated compute and I/O: Sixteen Arm® Cortex®‑A72 cores with extensive SerDes, PCIe, Ethernet and peripheral sets reduce board complexity and BOM.
• Hardware offload engines: Dedicated security and compression accelerators enable higher throughput with lower host CPU utilization.
• Packet‑aware caching: On‑chip packet cache minimizes external memory dependence for lower latency and reduced power in packet processing workloads.
• Industrial ready: Industrial qualification and −40 °C to 105 °C operating range support demanding embedded deployments.
• Compact FCBGA package: 1517‑FCPBGA (40×40) package enables dense board integration for constrained spaces.
• Long portfolio support: Layerscape family software ecosystem including Linux SDK and CodeWarrior support aids development and long‑term maintenance.

Why Choose LX2160XN71826B?

The LX2160XN71826B combines multi‑core Arm® Cortex®‑A72 performance with broad, high‑speed I/O and dedicated offload engines, making it a strong choice for developers building high‑throughput networking, edge compute, and industrial applications. Its integrated feature set—DDR4 with ECC, dual 100 Gbit/s Ethernet capability, SerDes/PCIe flexibility, and security/compression accelerators—reduces external components and simplifies system architecture.

For designs that demand scalable performance, robust I/O, and industrial temperature operation, this device offers a balanced platform with an established Layerscape software ecosystem to accelerate time‑to‑market and long‑term product support.

Request a quote or submit an inquiry for LX2160XN71826B to receive pricing and availability information and to discuss lead time and volume options.