XC7S25-1CSGA324I

The XC7S25-1CSGA324I is a Spartan®-7 field programmable gate array (FPGA) IC from AMD, supplied in a 324-LFBGA / CSPBGA package. It provides 23,360 logic elements and approximately 1.66 Mbits of embedded memory, with 150 user I/Os, making it suitable for mid-density, board-level FPGA implementations that require industrial-grade operation.

Designed for surface-mount integration, the device operates from a 0.95 V to 1.05 V core supply and is specified for an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant and packaged as a 324-CSGA (15×15) supplier device package.

Key Features

• Logic Capacity 23,360 logic elements provide the capacity for moderate-complexity custom logic and control functions on-chip.
• Embedded Memory Approximately 1.66 Mbits of on-chip RAM for local buffering, state storage, and small data structures.
• I/O Count 150 user I/Os to interface with multiple peripherals and external devices without extensive I/O expansion.
• Power Core voltage supply range of 0.95 V to 1.05 V for standard low-voltage FPGA core domains.
• Package & Mounting 324-LFBGA / CSPBGA package; supplier device package 324-CSGA (15×15); surface-mount mounting type for PCB-level assembly.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control The industrial temperature rating and 150 I/Os make the device suitable for control systems and PLC-style functions that require reliable operation across a wide temperature range.
• Embedded System Integration Logic capacity and on-chip memory enable implementation of custom accelerators, glue logic, and protocol handling within embedded designs.
• Board-Level FPGA Designs Compact 324-LFBGA packaging and surface-mount mounting support dense board integration for mid-density programmable logic applications.

Unique Advantages

• High Logic Density: 23,360 logic elements allow integration of substantial custom logic without external processors for many mid-range designs.
• On-Chip Memory: Approximately 1.66 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Generous I/O: 150 user I/Os simplify interfacing to sensors, actuators, and peripherals, lowering the need for additional I/O expanders.
• Industrial Temperature Range: Rated −40 °C to 100 °C to support deployments in temperature-challenging environments.
• Compact Surface-Mount Package: 324-LFBGA / 324-CSGA (15×15) footprint supports high-density PCB layouts and automated assembly.
• RoHS Compliant: Aligns with environmental and regulatory requirements for lead-free electronics.

Why Choose XC7S25-1CSGA324I?

The XC7S25-1CSGA324I positions itself as a practical, mid-density Spartan®-7 FPGA option from AMD for designs that need a balance of logic capacity, embedded memory, and I/O in a compact, industrial-grade package. Its specification set—23,360 logic elements, approximately 1.66 Mbits of RAM, 150 I/Os, and a −40 °C to 100 °C operating range—makes it appropriate for board-level integration where reliability and predictable electrical characteristics are required.

For engineers and procurement teams specifying FPGAs for industrial or embedded projects, this part delivers on core capacity and board-level integration while maintaining RoHS compliance and a compact 324-LFBGA surface-mount form factor.

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