XC7S25-1FTGB196C

The XC7S25-1FTGB196C is a Spartan®-7 FPGA IC designed for commercial-grade embedded logic applications. It integrates a substantial programmable fabric, on-chip memory, and a flexible I/O count in a compact 196-LBGA package.

With 23,360 logic elements, approximately 1.658880 Mbits of embedded RAM, and support for up to 100 I/O, this device targets space-constrained commercial systems that require configurable hardware resources and low-voltage core operation.

Key Features

• Programmable Logic Capacity — 1825 configurable logic blocks and 23,360 logic elements provide a programmable fabric for implementing custom digital logic.
• On‑Chip Memory — Approximately 1.658880 Mbits of embedded RAM for buffering, FIFOs, and small on-chip data storage.
• Flexible I/O — Up to 100 I/O pins to interface with external peripherals and subsystems.
• Low‑Voltage Core — Core supply range of 0.95 V to 1.05 V to match low-voltage system architectures.
• Compact Package — 196-LBGA, CSPBGA package (supplier device package: 196-CSBGA, 15×15) for board designs with tight area constraints; surface-mount mounting.
• Commercial Grade — Specified operating temperature range of 0°C to 85°C and commercial grade classification for typical commercial deployments.
• RoHS Compliant — Environmental compliance for lead-free assembly and global supply chain requirements.

Typical Applications

• Commercial Embedded Systems — Programmable logic and on-chip RAM support customization and control functions in commercial products that operate within 0°C to 85°C.
• Interface and I/O Expansion — Up to 100 I/O lines enable hardware-level protocol bridging, preprocessing, or peripheral interfacing in compact designs.
• Control and Signal Processing — The combined logic capacity and embedded memory allow implementation of control algorithms, finite-state machines, and small-scale signal processing tasks.

Unique Advantages

• Right‑sized Logic for Compact Designs: 23,360 logic elements deliver meaningful programmable capacity while fitting in space-limited packages.
• Integrated Memory Resources: Approximately 1.658880 Mbits of on-chip RAM reduces the need for external memory for buffering and small data stores.
• Low‑Voltage Core Operation: A 0.95 V–1.05 V supply window aligns with modern low-voltage system power domains.
• Compact LBGA Package: 196-LBGA (196-CSBGA, 15×15) minimizes PCB footprint and supports surface-mount assembly workflows.
• Commercial Temperature Range: Rated for 0°C to 85°C to match typical commercial application environments.
• Environmentally Compliant: RoHS compliance supports lead-free manufacturing requirements.

Why Choose XC7S25-1FTGB196C?

The XC7S25-1FTGB196C positions itself as a compact, commercial-grade FPGA solution that balances programmable logic capacity, embedded memory, and I/O flexibility within a small LBGA footprint. Its low-voltage core and surface-mount package make it suitable for space- and power-constrained commercial designs that require on-board reconfigurability.

This device is well suited for engineers and procurement teams seeking a programmable silicon component that provides scalability in logic and memory resources while maintaining commercial temperature and RoHS-compliant manufacturing compatibility.

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