XC7S25-2CSGA225C

IC FPGA 150 I/O 225CSGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 225-LFBGA, CSPBGA

Quantity 1,843 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case225-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7S25-2CSGA225C – Spartan®-7 Field Programmable Gate Array (225-LFBGA)

The XC7S25-2CSGA225C is a Spartan®-7 Field Programmable Gate Array (FPGA) IC in a 225-ball LFBGA/CSPBGA package designed for commercial-grade designs. It provides programmable logic resources, on-chip memory, and a generous I/O count in a compact surface-mount package.

With 23,360 logic elements, approximately 1.66 Mbits of embedded memory and up to 150 I/Os, this device targets applications that require mid-range programmable logic capacity and flexible system integration while operating within a commercial temperature range.

Key Features

  • Core Logic  23,360 logic elements provide the programmable fabric needed for mid-range logic integration and custom digital functions.
  • Embedded Memory  Approximately 1.66 Mbits of on-chip RAM supports data buffering, FIFOs, and small on-chip data structures without external memory.
  • I/O Density  Up to 150 general-purpose I/Os allow multiple interfaces and peripheral connections from a single device.
  • Power  Core voltage supply range of 0.95 V to 1.05 V supports standard low-voltage FPGA power domains.
  • Package & Mounting  225-LFBGA, CSPBGA package (225-CSGA, 13×13) in a surface-mount form factor for compact PCB integration and high-density boards.
  • Temperature & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C for mainstream commercial applications.
  • Environmental  RoHS-compliant construction meets common environmental and manufacturing requirements.

Typical Applications

  • Commercial Embedded Systems  Implement custom digital functions, control logic and peripheral interfacing using the device's 23,360 logic elements and 150 I/Os.
  • Prototyping & Development  Use the Spartan‑7 FPGA for proof-of-concept designs and hardware validation where mid-range logic capacity and on-chip RAM are required.
  • Communications Equipment  Integrate protocol bridging, packet buffering or signal control functions leveraging the device's embedded memory and abundant I/O.
  • Consumer Electronics  Enable configurable logic and custom peripheral control in compact, surface-mount form factors for commercial consumer products.

Unique Advantages

  • Balanced Logic Capacity: 23,360 logic elements deliver a mid-range programmable fabric suitable for a wide set of digital functions without over-provisioning.
  • On‑Chip Memory: Approximately 1.66 Mbits of embedded RAM reduces reliance on external memory for buffering and small data structures.
  • High I/O Count: Up to 150 I/Os support multiple peripheral interfaces and simplify board-level integration.
  • Compact, Surface‑Mount Package: The 225-LFBGA/CSPBGA (225-CSGA, 13×13) package enables high-density PCB layouts and reliable surface-mount assembly.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for mainstream commercial applications and environments.
  • RoHS Compliant: Built to meet common environmental manufacturing standards for lead-free production.

Why Choose XC7S25-2CSGA225C?

The XC7S25-2CSGA225C positions itself as a practical Spartan®-7 FPGA option for designers seeking mid-range programmable logic, meaningful on-chip memory, and substantial I/O in a compact surface-mount package. Its commercial-grade rating and support for standard low-voltage cores make it appropriate for mainstream product development and prototyping.

Backed by AMD as the manufacturer, this device suits teams that require predictable logic capacity (23,360 logic elements), approximately 1.66 Mbits of embedded RAM, and up to 150 I/Os packaged in a 225-ball LFBGA/CSPBGA footprint—helping streamline board-level integration and long-term design planning.

Request a quote or submit an inquiry to get pricing and availability for the XC7S25-2CSGA225C. Our team can provide lead-time information and ordering support tailored to your volume and delivery needs.

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