XC7S25-2CSGA324I

IC FPGA 150 I/O 324CSGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 324-LFBGA, CSPBGA

Quantity 91 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7S25-2CSGA324I – Spartan®-7 Field Programmable Gate Array (FPGA) IC, 150 I/Os, ~1.66 Mbits RAM, 23,360 Logic Elements

The XC7S25-2CSGA324I is a Spartan®-7 Field Programmable Gate Array (FPGA) in a 324-LFBGA / CSPBGA package. It delivers mid-range programmable logic capacity with embedded memory and a substantial I/O complement for industrial embedded designs.

Key device characteristics include 23,360 logic elements, approximately 1.66 Mbits of on-chip RAM, 150 I/Os, an industrial operating temperature range, and a low-voltage core supply window.

Key Features

  • Core Architecture Spartan®-7 FPGA architecture in a 324-LFBGA / CSPBGA package, supplied as part number XC7S25-2CSGA324I.
  • Logic Capacity 23,360 logic elements with 1,825 configurable logic blocks (CLBs) to support medium-complexity programmable logic designs.
  • Embedded Memory Approximately 1.66 Mbits of on-chip RAM for buffering, FIFO, and small data-store requirements.
  • I/O Count 150 user I/Os, enabling connectivity to a broad range of peripheral devices and interfaces.
  • Power Core supply range of 0.950 V to 1.050 V to support low-voltage system designs.
  • Package & Mounting Supplied in a 324-LFBGA (supplier device package: 324-CSGA, 15×15 mm) surface-mount package for compact board-level integration.
  • Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployed systems.
  • Environmental Compliance RoHS compliant to meet common environmental restrictions in commercial and industrial products.

Unique Advantages

  • Balanced Logic and Memory: The combination of 23,360 logic elements and ~1.66 Mbits of embedded RAM supports a wide range of mid-range FPGA tasks without external memory for some use cases.
  • High I/O Count: 150 I/Os provide flexibility to interface multiple sensors, peripherals, and daughtercards directly to the FPGA.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C, suitable for industrial environments where extended temperature tolerance is required.
  • Compact Surface-Mount Package: 324-LFBGA (324-CSGA, 15×15) package enables dense board layouts while keeping a robust pinout for complex designs.
  • Low-Voltage Core: Narrow core supply window (0.950–1.050 V) that aligns with low-voltage system power architectures.
  • Regulatory Compliance: RoHS compliance simplifies environmental conformance in product design and manufacturing.

Why Choose XC7S25-2CSGA324I?

The XC7S25-2CSGA324I positions itself as a dependable mid-range Spartan‑7 FPGA option for industrial embedded projects that need a balance of logic density, on-chip memory, and flexible I/O. Its industrial temperature rating and compact 324-LFBGA package make it suitable for applications that require robust operation in constrained board space.

Choose this device when your design requires moderate programmable logic capacity (23,360 logic elements), meaningful embedded RAM (approximately 1.66 Mbits), and a high I/O count delivered in a surface-mount, RoHS-compliant package—providing scalability and integration for a wide range of industrial designs.

Request a quote or submit a pricing inquiry to check availability and obtain customized procurement terms for the XC7S25-2CSGA324I.

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