XC7S25-L1CSGA225I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 225-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,404 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 225-CSGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-LFBGA, CSPBGA | Number of I/O | 150 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1825 | Number of Logic Elements/Cells | 23360 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1658880 |
Overview of XC7S25-L1CSGA225I – Spartan®-7 FPGA IC, 150 I/O, ~1.66 Mbit RAM
The XC7S25-L1CSGA225I is a Spartan®-7 field programmable gate array (FPGA) IC from AMD provided in a 225-pin LFBGA/CSPBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density for systems that require configurable digital logic within an industrial temperature range.
This device is suitable for designs that need up to 150 I/O lines, approximately 1.66 Mbits of on-chip RAM, and 23,360 logic elements while operating from a low-voltage supply of 0.920–0.980 V and across an operating temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 23,360 logic elements provide the programmable fabric required for implementing custom digital functions and control logic.
- Embedded Memory Approximately 1.66 Mbits of on-chip RAM (1,658,880 bits) for buffering, state storage, and small data structures.
- I/O Density 150 general-purpose I/O pins to support parallel interfaces, external peripherals, and I/O-heavy designs.
- Power Supply Operates from a core voltage supply range of 0.920 V to 0.980 V to match low-voltage system requirements.
- Package and Mounting 225-LFBGA (CSPBGA) package, supplier device package 225-CSGA (13×13), optimized for surface-mount assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal requirements in demanding environments.
- Regulatory RoHS compliant.
Typical Applications
- I/O-Intensive Interfaces Use the 150 I/O pins to implement parallel and mixed-signal interface bridging or peripheral aggregation in embedded systems.
- Control and Logic Acceleration Leverage 23,360 logic elements and on-chip RAM to accelerate deterministic control loops, protocol handling, and custom state machines.
- Industrial Systems Deploy in industrial equipment where the −40 °C to 100 °C operating range and surface-mount 225-LFBGA package are required.
Unique Advantages
- Balanced Logic and Memory: 23,360 logic elements paired with approximately 1.66 Mbits of embedded memory support both combinational logic and local buffering without external RAM for many mid-range designs.
- High I/O Count: 150 I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing the need for additional I/O expanders.
- Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployments in thermally challenging environments.
- Compact, Surface-Mount Package: The 225-LFBGA (225-CSGA, 13×13) package enables compact board layouts and standard surface-mount manufacturing.
- Low-Voltage Core: Core supply range of 0.920–0.980 V supports low-voltage system designs and power-managed applications.
- Manufactured by AMD: Sourcing from a recognized semiconductor manufacturer ensures traceability and consistent device availability.
Why Choose XC7S25-L1CSGA225I?
The XC7S25-L1CSGA225I positions itself as a mid-range Spartan®-7 FPGA option that combines a substantial logic element count with nearly 1.66 Mbits of on-chip RAM and a high I/O count in a compact LFBGA package. Its low-voltage core and industrial temperature rating make it appropriate for embedded and industrial designs that require reliable, reconfigurable logic close to system peripherals.
This device is well suited for engineers and procurement teams designing compact, I/O-centric systems that need programmable logic and on-chip memory while operating across a wide temperature range. Choosing this FPGA supports design scalability within FPGA-based architectures and the practicality of surface-mount board assembly.
If you would like pricing information or to request a quote for the XC7S25-L1CSGA225I, submit a quote request or contact sales to receive current availability and lead-time details.

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