XC7S25-L1CSGA225I

IC FPGA 150 I/O 225CSGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 225-LFBGA, CSPBGA

Quantity 1,404 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case225-LFBGA, CSPBGANumber of I/O150Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7S25-L1CSGA225I – Spartan®-7 FPGA IC, 150 I/O, ~1.66 Mbit RAM

The XC7S25-L1CSGA225I is a Spartan®-7 field programmable gate array (FPGA) IC from AMD provided in a 225-pin LFBGA/CSPBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density for systems that require configurable digital logic within an industrial temperature range.

This device is suitable for designs that need up to 150 I/O lines, approximately 1.66 Mbits of on-chip RAM, and 23,360 logic elements while operating from a low-voltage supply of 0.920–0.980 V and across an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  23,360 logic elements provide the programmable fabric required for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 1.66 Mbits of on-chip RAM (1,658,880 bits) for buffering, state storage, and small data structures.
  • I/O Density  150 general-purpose I/O pins to support parallel interfaces, external peripherals, and I/O-heavy designs.
  • Power Supply  Operates from a core voltage supply range of 0.920 V to 0.980 V to match low-voltage system requirements.
  • Package and Mounting  225-LFBGA (CSPBGA) package, supplier device package 225-CSGA (13×13), optimized for surface-mount assembly.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet thermal requirements in demanding environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • I/O-Intensive Interfaces  Use the 150 I/O pins to implement parallel and mixed-signal interface bridging or peripheral aggregation in embedded systems.
  • Control and Logic Acceleration  Leverage 23,360 logic elements and on-chip RAM to accelerate deterministic control loops, protocol handling, and custom state machines.
  • Industrial Systems  Deploy in industrial equipment where the −40 °C to 100 °C operating range and surface-mount 225-LFBGA package are required.

Unique Advantages

  • Balanced Logic and Memory: 23,360 logic elements paired with approximately 1.66 Mbits of embedded memory support both combinational logic and local buffering without external RAM for many mid-range designs.
  • High I/O Count: 150 I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing the need for additional I/O expanders.
  • Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployments in thermally challenging environments.
  • Compact, Surface-Mount Package: The 225-LFBGA (225-CSGA, 13×13) package enables compact board layouts and standard surface-mount manufacturing.
  • Low-Voltage Core: Core supply range of 0.920–0.980 V supports low-voltage system designs and power-managed applications.
  • Manufactured by AMD: Sourcing from a recognized semiconductor manufacturer ensures traceability and consistent device availability.

Why Choose XC7S25-L1CSGA225I?

The XC7S25-L1CSGA225I positions itself as a mid-range Spartan®-7 FPGA option that combines a substantial logic element count with nearly 1.66 Mbits of on-chip RAM and a high I/O count in a compact LFBGA package. Its low-voltage core and industrial temperature rating make it appropriate for embedded and industrial designs that require reliable, reconfigurable logic close to system peripherals.

This device is well suited for engineers and procurement teams designing compact, I/O-centric systems that need programmable logic and on-chip memory while operating across a wide temperature range. Choosing this FPGA supports design scalability within FPGA-based architectures and the practicality of surface-mount board assembly.

If you would like pricing information or to request a quote for the XC7S25-L1CSGA225I, submit a quote request or contact sales to receive current availability and lead-time details.

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