XC7S50-1CSGA324C

The XC7S50-1CSGA324C is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides programmable logic resources, embedded RAM, and a substantial I/O count in a compact 324-ball LFBGA / CSPBGA package for surface-mount applications.

Engineered for commercial-grade applications, this device targets designs that require on-chip memory, flexible logic capacity, and broad I/O connectivity while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic — 52,160 logic elements providing programmable logic capacity for customized digital functions and glue logic.
• Embedded Memory — Approximately 2.76 Mbits of on-chip RAM for local data storage, buffering, and small FPGA-based memory implementations.
• I/O Capacity — 210 user I/O pins to support multiple peripheral interfaces and parallel connections.
• Power — Core supply range of 950 mV to 1.05 V to match typical low-voltage FPGA power rails.
• Package & Mounting — 324-LFBGA, CSPBGA package; supplier device package 324-CSGA (15×15); surface-mount mounting for compact PCB integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Regulatory — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Custom digital logic — Implement state machines, protocol bridges, and application-specific logic using the device’s 52,160 logic elements and embedded RAM.
• I/O-rich interfaces — Drive parallel buses, sensor arrays, or multiple serial interfaces using the 210 available I/O pins.
• On-chip buffering and control — Use approximately 2.76 Mbits of embedded memory for buffering, FIFOs, and local data storage within compact system designs.
• Compact surface-mount systems — Integrate programmable logic into space-constrained PCBs with the 324-ball LFBGA (324-CSGA, 15×15) surface-mount package.

Unique Advantages

• Substantial logic capacity: 52,160 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board space.
• On-chip memory: Approximately 2.76 Mbits of embedded RAM supports local data buffering and reduces external memory dependency.
• High I/O count: 210 I/Os provide flexibility to connect numerous peripherals and interfaces without additional multiplexing hardware.
• Compact package and surface-mount mounting: The 324-LFBGA / 324-CSGA (15×15) package supports high-density PCB designs and automated assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, appropriate for mainstream commercial electronics deployments.
• RoHS compliant: Conforms to lead-free manufacturing requirements for modern assembly processes.

Why Choose XC7S50-1CSGA324C?

The XC7S50-1CSGA324C combines a sizable pool of logic elements, meaningful on-chip RAM, and a high I/O count in a compact surface-mount LFBGA package from AMD. Its specification set supports designs that require integrated programmable logic, local memory, and extensive connectivity within commercial temperature and voltage ranges.

This part is suited for engineers and procurement teams building compact, I/O-driven systems that benefit from consolidating discrete functions into a single FPGA device backed by an established manufacturer.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC7S50-1CSGA324C.