XC7S50-1CSGA324I

IC FPGA 210 I/O 324CSGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 210 2764800 52160 324-LFBGA, CSPBGA

Quantity 1,819 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7S50-1CSGA324I – Spartan®-7 FPGA (Industrial, 324-LFBGA)

The XC7S50-1CSGA324I is a Spartan®-7 field programmable gate array (FPGA) from AMD supplied in a 324-LFBGA/CSPBGA package. It provides a mid-range combination of logic capacity, embedded memory, and I/O density in a surface-mount 324-CSGA (15×15) footprint.

Specified for industrial use, this device offers on-chip resources and electrical/thermal limits suitable for designs that require quantifiable logic, memory, and I/O in a compact package.

Key Features

  • Core Spartan®-7 FPGA architecture supplied in the XC7S50-1CSGA324I part.
  • Logic 52,160 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory Approximately 2.76 Mbits of on-chip RAM for data buffering, state storage, and small on-chip memories.
  • I/O 210 user I/O pins to support a wide range of external interfaces and board-level connectivity.
  • Power Core voltage supply range: 950 mV to 1.05 V, enabling defined power rail design for the FPGA core.
  • Package & Mounting 324-LFBGA, CSPBGA package; supplier device package 324-CSGA (15×15); surface-mount mounting type for compact board integration.
  • Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-variable environments.
  • Compliance RoHS compliant.

Unique Advantages

  • Measurable logic capacity: 52,160 logic elements gives a clear resource target for mid-range FPGA designs and budgeting of logic utilization.
  • On-chip memory integration: Approximately 2.76 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
  • Substantial I/O count: 210 user I/Os enable direct connections to multiple peripherals, sensors, and interface PHYs without excessive board-level multiplexing.
  • Industrial-grade thermal range: Specified −40 °C to 100 °C for applications that require extended environmental tolerance.
  • Compact BGA footprint: 324-LFBGA / 324-CSGA (15×15) packaging supports dense board designs while maintaining good pin count.
  • Defined core supply window: 950 mV–1.05 V supply range simplifies power-supply selection and verification for the FPGA core.

Why Choose XC7S50-1CSGA324I?

The XC7S50-1CSGA324I positions itself as a practical, industrial-grade Spartan®-7 FPGA option that combines a clear logic complement (52,160 logic elements), substantial embedded memory (approximately 2.76 Mbits), and 210 user I/Os in a compact 324-LFBGA package. Its defined core voltage window and wide operating temperature range make it suitable for system designs that require predictable, quantifiable FPGA resources in industrial environments.

This part is appropriate for engineers and procurement teams seeking a mid-range FPGA footprint with known resource counts and package constraints, offering straightforward integration into surface-mount, industrial-temperature designs.

If you would like pricing, availability, or to request a quote for the XC7S50-1CSGA324I, please submit an inquiry or request a quote and our team will respond with the requested information.

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