XC7S50-1CSGA324Q

The XC7S50-1CSGA324Q is a Spartan®-7 field programmable gate array (FPGA) IC from AMD, offered in a 324‑LFBGA (324‑CSGA, 15×15) surface‑mount package. It provides a balance of programmable logic, on‑chip memory and I/O density tailored for applications requiring automotive qualification and wide operating temperature range.

Key on‑device characteristics include 52,160 logic elements, approximately 2.76 Mbits of embedded memory, up to 210 I/O, a core supply range of 0.95 V to 1.05 V, RoHS compliance and AEC‑Q100 qualification for automotive use.

Key Features

• Core Logic  52,160 logic elements provide programmable fabric for custom digital logic implementations and control functions.
• Embedded Memory  Approximately 2.76 Mbits of on‑chip RAM for buffering, state storage and local data processing.
• I/O Capacity  Up to 210 general‑purpose I/O pins to support high‑pin‑count interfacing and multiple peripheral connections.
• Power Supply  Core supply range from 0.95 V to 1.05 V to match system power rails and support defined core voltage requirements.
• Package & Mounting  324‑LFBGA (324‑CSGA, 15×15) surface‑mount package for compact PCB integration and reliable solder mounting.
• Automotive Qualification & Temperature  AEC‑Q100 qualification with an operating temperature range of −40 °C to 125 °C for automotive and other temperature‑demanding environments.
• Compliance  RoHS‑compliant to meet lead‑free manufacturing and regulatory requirements.

Typical Applications

• Automotive Control Systems  AEC‑Q100 qualification and wide operating temperature make this FPGA suitable for vehicle control and module integration where automotive qualification is required.
• Embedded Signal Processing  The combination of 52,160 logic elements and ~2.76 Mbits of RAM supports on‑chip data processing, filtering and control algorithms.
• High‑Density I/O Interfaces  Up to 210 I/O pins enable multi‑channel sensor interfaces, communication hubs and complex peripheral aggregation.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification provides documented suitability for automotive applications requiring component qualification.
• Balanced logic and memory: 52,160 logic elements paired with approximately 2.76 Mbits of embedded RAM supports diverse logic and buffering needs on a single device.
• High I/O count: 210 I/O pins simplify board routing and reduce the need for external multiplexing or expansion components.
• Compact LFBGA package: 324‑LFBGA (324‑CSGA, 15×15) surface‑mount package enables dense PCB layouts while maintaining robust solderable connections.
• Wide temperature operation: Specification from −40 °C to 125 °C addresses demanding thermal environments commonly found in automotive and industrial applications.
• Regulatory readiness: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose XC7S50-1CSGA324Q?

The XC7S50-1CSGA324Q positions itself as an automotive‑qualified Spartan®‑7 FPGA option that combines moderate logic density, embedded memory and substantial I/O capability in a compact 324‑LFBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it suitable for designs that require documented automotive component status and robust temperature tolerance.

Designed and supplied by AMD with supporting product documentation, this device is suited for engineering teams seeking a programmable logic device with clear electrical and packaging specifications, automotive qualification, and RoHS compliance for long‑term integration into vehicle and temperature‑sensitive systems.

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