XC7S50-1FGGA484Q

The XC7S50-1FGGA484Q is a Spartan®-7 Field Programmable Gate Array (FPGA) from AMD presented in a 484-BGA surface-mount package (484-FPBGA, 23×23). It delivers a substantial logic fabric—52,160 logic elements—and approximately 2.76 Mbits of embedded memory for on-chip data buffering and application logic.

Designed with a broad operating range and automotive qualification, this device is suitable for designs that require high logic capacity, significant I/O count (250 pins), and operation across –40 °C to 125 °C with a core supply range of 0.95 V to 1.05 V.

Key Features

• Logic Capacity  Offers 52,160 logic elements to implement complex custom logic, finite-state machines, and control functions.
• Embedded Memory  Approximately 2.76 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without external memory.
• I/O  250 general-purpose I/O pins provide flexible interfacing for sensors, actuators, buses, and peripheral devices.
• Power  Core supply voltage range of 0.95 V to 1.05 V to match system power rails and meet tight power budgets.
• Package & Mounting  484-BGA package in a 23×23 FPBGA footprint for high-density, surface-mount board integration.
• Automotive Qualification  AEC-Q100 qualification and an automotive grade designation for use in temperature- and reliability-sensitive vehicle applications.
• Operating Temperature  Rated for –40 °C to 125 °C operation to support designs with wide environmental demands.
• Compliance  RoHS-compliant for regulatory and environmental considerations.

Typical Applications

• Automotive Control Systems  Applicable in vehicle electronics where AEC-Q100 qualification, wide operating temperature, and deterministic logic capacity are required for tasks such as sensor interfacing and domain processing.
• High‑Density I/O Bridging  Use the 250 I/O pins to implement protocol bridges, custom interfaces, and multi-signal aggregation in compact board layouts.
• Embedded Logic and Data Handling  Leverage 52,160 logic elements and ~2.76 Mbits of on-chip RAM for control algorithms, packet buffering, and real-time data processing without immediate external memory.
• Compact Surface-Mount Designs  The 484-BGA (23×23) surface-mount package supports space-constrained designs that require high integration density.

Unique Advantages

• Automotive-Grade Qualification:  AEC-Q100 qualification and automotive grade designation enable use in vehicle environments with elevated reliability expectations.
• Significant On-Chip Resources:  52,160 logic elements combined with approximately 2.76 Mbits of RAM reduce dependence on external components for many control and buffering tasks.
• High I/O Count:  250 I/O pins simplify integration with multiple sensors, actuators, and peripheral buses, minimizing external multiplexers or interface chips.
• Wide Temperature Range:  Operation from –40 °C to 125 °C supports deployments across demanding thermal environments.
• Compact Packaging:  484-FPBGA (23×23) packaging provides a balance of density and manufacturability for surface-mount production flows.

Why Choose XC7S50-1FGGA484Q?

The XC7S50-1FGGA484Q from AMD combines extensive logic capacity and embedded memory with a high I/O count in a compact 484-BGA footprint, addressing applications that require compact integration and reliable operation across a wide temperature range. Its automotive grade and AEC-Q100 qualification make it a viable option for designs that must meet vehicle-level reliability and environmental requirements.

This device is suited to engineers and procurement teams building systems that need substantial on-chip resources, flexible interfacing, and automotive-grade robustness while keeping board-level complexity and external component count under control.

Request a quote or submit an inquiry to get pricing and availability for the XC7S50-1FGGA484Q and discuss how it fits your next design.