XC7S50-2CSGA324C

IC FPGA 210 I/O 324CSBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 210 2764800 52160 324-LFBGA, CSPBGA

Quantity 1,541 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7S50-2CSGA324C – Spartan®-7 Field Programmable Gate Array (FPGA)

The XC7S50-2CSGA324C is a Spartan®-7 Field Programmable Gate Array (FPGA) in a 324-LFBGA (324-CSPBGA, 15×15) package designed for commercial applications. It provides a balance of programmable logic, on-chip memory and I/O resources for custom digital designs operating within standard commercial temperature and supply ranges.

This device is suitable for commercial embedded systems that require moderate logic capacity, significant embedded RAM, and a sizable number of I/Os in a surface-mount BGA package.

Key Features

  • Logic Capacity  Approximately 52,160 logic elements delivered through the device's programmable fabric, enabling implementation of custom digital functions and control logic.
  • Configurable Logic Blocks (CLBs)  4,075 CLBs provide the structured logic resources used to build custom combinational and sequential circuits.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM for buffering, lookup tables and small data storage requirements within the FPGA fabric.
  • I/O Count  210 I/O pins for interfacing with peripherals, sensors, and external devices in complex mixed-signal systems.
  • Power  Core supply range from 0.950 V to 1.05 V to match standard low-voltage FPGA power domains.
  • Package & Mounting  324-LFBGA (324-CSPBGA, 15×15) surface-mount package suitable for compact board layouts and automated assembly.
  • Operating Conditions  Commercial grade operation with specified ambient temperature range from 0 °C to 85 °C.
  • Regulatory  RoHS compliant for lead-free assembly and environmentally conscious designs.

Typical Applications

  • Embedded systems and prototyping  Use the 52,160 logic elements and 210 I/Os to implement custom peripherals, control logic and rapid system prototypes for commercial products.
  • Communications and interface bridging  Deploy the device’s on-chip RAM and I/O resources to handle protocol translation, buffering and custom interface logic in communication equipment.
  • Industrial and commercial control  Implement motor control, sensor aggregation and deterministic control functions within the commercial temperature range supported by the device.

Unique Advantages

  • Substantial logic density: 52,160 logic elements provide capacity for mid-range custom logic implementations without external programmable logic expansion.
  • Integrated on-chip memory: Approximately 2.76 Mbits of embedded RAM reduces the need for external memory for many buffering and LUT requirements.
  • Generous I/O count: 210 I/Os enable broad peripheral connectivity and flexible system partitioning between FPGA and external components.
  • Compact BGA package: 324-CSPBGA (15×15) supports space-constrained board designs while remaining suitable for surface-mount assembly workflows.
  • Commercial grade operation: Rated for 0 °C to 85 °C to meet typical commercial application environments and supply chains.
  • RoHS compliant: Facilitates compliance with environmental regulations and lead-free manufacturing processes.

Why Choose XC7S50-2CSGA324C?

The XC7S50-2CSGA324C positions itself as a mid-range Spartan®-7 FPGA option for commercial designs that need a balance of logic capacity, embedded memory and I/O in a compact BGA package. Its combination of 52,160 logic elements, roughly 2.76 Mbits of on-chip RAM and 210 I/Os makes it well suited to embedded systems, communications interface logic and commercial control applications.

With a low-voltage core supply range (0.950–1.05 V), surface-mount 324-CSPBGA package and RoHS compliance, this device is aimed at designers seeking a programmable, upgradeable building block that fits standard commercial temperature and manufacturing requirements.

Request a quote or submit a sales inquiry to receive pricing and availability information for the XC7S50-2CSGA324C.

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