XC7S50-2FGGA484C

IC FPGA 250 I/O 484FBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 250 2764800 52160 484-BBGA

Quantity 1,140 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O250Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7S50-2FGGA484C – Spartan®-7 FPGA, 484-BBGA, 250 I/O

The XC7S50-2FGGA484C is a Spartan®-7 Field Programmable Gate Array (FPGA) IC designed for commercial embedded designs that require configurable logic, significant on-chip memory, and a high I/O count. The device provides a balance of logic capacity, embedded RAM and I/O density in a compact 484-ball BGA package.

Key Features

  • Core Logic  4,075 configurable logic blocks (CLBs) and 52,160 logic elements support complex programmable logic implementations.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM for buffering, look-up tables and local data storage.
  • I/O Density  250 programmable I/O pins to support a variety of external interfaces and parallel connectivity.
  • Power  Core voltage supply range of 950 mV to 1.05 V for operation within defined power rails.
  • Package & Mounting  484-BBGA package; supplier device package listed as 484-FBGA (23×23). Surface-mount device for board-level assembly.
  • Operating Range  Commercial grade operation from 0°C to 85°C to match typical commercial embedded environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Custom digital logic and glue functions  Use the programmable CLBs and logic elements to implement tailored control, protocol bridging or glue logic between subsystems.
  • On-board buffering and state storage  Approximately 2.76 Mbits of embedded RAM supports local buffering, FIFOs and temporary data storage for system tasks.
  • High-pin-count I/O designs  With 250 I/O pins, integrate multiple sensors, peripherals or parallel interfaces directly to the FPGA.

Unique Advantages

  • Balanced logic and memory  Combines 52,160 logic elements with approximately 2.76 Mbits of RAM to support both compute and data storage needs on a single device.
  • High I/O capacity  250 I/O pins reduce the need for additional interface ICs and simplify board-level routing for multi-signal systems.
  • Compact surface-mount package  484-BBGA (484-FBGA, 23×23) delivers high integration density in a small footprint for space-constrained designs.
  • Commercial temperature range  Rated for 0°C to 85°C operation to suit commercial embedded applications.
  • RoHS compliant  Meets RoHS requirements for environmental and manufacturing compliance.

Why Choose XC7S50-2FGGA484C?

The XC7S50-2FGGA484C offers a practical combination of programmable logic capacity, embedded memory and high I/O count in a compact BGA package, making it well suited for commercial embedded designs that require on-chip logic and local storage. Its defined core voltage range and commercial temperature rating support deployment in standard electronic products and development platforms.

Engineers and procurement teams looking for a configurable solution with clear, verifiable specifications for logic, memory, I/O and packaging will find this Spartan®-7 device a fit for designs that prioritize integration and predictable electrical and thermal characteristics.

Request a quote or submit a purchase inquiry for XC7S50-2FGGA484C to receive pricing and availability information tailored to your project needs.

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