XC7S50-1FTGB196Q

The XC7S50-1FTGB196Q is a Spartan®-7 FPGA device providing reconfigurable logic and on-chip memory in a compact 196-LBGA package. It delivers measurable on-chip resources and I/O density for designs that require configurable logic, embedded memory, and predictable electrical and thermal operating ranges.

With AEC-Q100 qualification, a wide operating temperature range and a low-voltage core supply window, the device is positioned for applications where automotive qualification, extended temperature tolerance and compact surface-mount packaging are required.

Key Features

• Logic Capacity  52,160 logic elements and 4,075 CLBs provide programmable resources for implementing custom logic, state machines and glue-logic.
• Embedded Memory  Approximately 2.76 Mbits of on-chip RAM supports buffering, small data tables and local storage without external memory.
• I/O Resources  100 user I/O pins accommodate a range of peripheral interfaces and board-level signal routing in a single device.
• Power and Core Supply  Core supply range of 0.95 V to 1.05 V supports standard low-voltage FPGA power domains.
• Package and Mounting  196-LBGA (196-CSBGA, 15 × 15) surface-mount package offers a compact footprint for space-constrained PCBs.
• Automotive Qualification  AEC-Q100 qualification indicates suitability for applications requiring automotive-grade device qualification.
• Temperature Range  Rated for operation from −40 °C to 125 °C to meet high ambient and extended-temperature system requirements.
• RoHS Compliance  RoHS-compliant construction supports environmentally conscious designs and manufacturing.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and a −40 °C to 125 °C operating range make the device suitable for vehicle electronics that require qualified, reconfigurable logic.
• I/O expansion and bridging  With 100 user I/Os and substantial logic capacity, the device can implement protocol conversion, bus bridging and custom interface logic.
• Embedded control and state machines  High logic element count and on-chip RAM enable implementation of control algorithms, sequencing logic and small data stores directly in the FPGA fabric.
• On-board buffering and small data processing  Approximately 2.76 Mbits of embedded memory supports local buffering, FIFOs and lookup tables for real-time data handling.

Unique Advantages

• Substantial programmability:  52,160 logic elements and 4,075 CLBs provide the capacity to integrate multiple functions into a single device.
• Automotive-ready qualification:  AEC-Q100 qualification enables use in applications that require automotive-grade component qualification and traceability.
• Compact package:  The 196-LBGA (15 × 15) package delivers a high-density solution for board designs with limited PCB area.
• Extended temperature tolerance:  Rated operation from −40 °C to 125 °C supports deployment in higher-temperature environments.
• On-chip memory resources:  Approximately 2.76 Mbits of embedded RAM reduces the need for some external memory components in targeted designs.
• Predictable power domain:  A defined core supply window of 0.95 V to 1.05 V supports consistent power planning and design integration.

Why Choose XC7S50-1FTGB196Q?

The XC7S50-1FTGB196Q combines a substantial logic element count, meaningful embedded memory and a 100-pin I/O complement in a compact 196-LBGA footprint. Its AEC-Q100 qualification, low-voltage core range and −40 °C to 125 °C operating window make it a practical choice for designs that require automotive-grade qualification and robust thermal performance.

This device is well suited to engineers building systems that need configurable logic capacity with embedded RAM and reliable operation across extended temperatures, offering a balanced platform for integration and long-term deployment within qualified applications.

Request a quote or contact sales to discuss pricing, availability and how the XC7S50-1FTGB196Q can fit your next design.