XC7S50-2CSGA324I

The XC7S50-2CSGA324I is an industrial-grade Spartan®-7 FPGA from AMD supplied in a 324-pin LFBGA/CSPBGA package. It provides a combination of configurable logic, substantial embedded memory and a large I/O count in a surface-mount, 15×15 324-CSPBGA package for space-efficient board designs.

Targeted at designs that require on-chip logic, multiple I/O interfaces and embedded RAM, this device supports core supply voltages from 0.95 V to 1.05 V and operates across an industrial temperature range of -40 °C to 100 °C.

Key Features

• Logic Capacity Approximately 52,160 logic elements to implement custom digital logic and state machines.
• Embedded Memory Approximately 2.76 Mbits of on-chip RAM for data buffering, lookup tables and local storage.
• I/O Resources 210 I/O pins providing flexible external interfacing for sensors, peripherals and host interfaces.
• Package and Mounting 324-LFBGA / 324-CSPBGA (15×15) surface-mount package for compact PCB integration.
• Power Core voltage supply range from 0.95 V to 1.05 V for system power planning and rail selection.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant to meet standard environmental and material requirements.

Typical Applications

• Embedded Control and Signal Processing Use the device's configurable logic and embedded RAM to implement custom control algorithms, signal filtering and real-time processing pipelines.
• I/O Aggregation and Protocol Bridging With 210 I/O pins, the FPGA can consolidate multiple peripheral interfaces and perform protocol translation between subsystems.
• Prototyping and Custom Logic Acceleration Leverage the available logic elements and on-chip memory to prototype ASIC functions or accelerate compute tasks within a compact package.

Unique Advantages

• Dense Configurable Logic: Approximately 52,160 logic elements allow complex custom logic implementations without external gate arrays.
• Significant On‑Chip Memory: Around 2.76 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Large I/O Count: 210 I/Os support multiple peripherals and interface options directly at the FPGA.
• Industrial Rating: -40 °C to 100 °C operating range enables deployment in industrial and temperature-variable environments.
• Compact Surface‑Mount Package: 324-CSPBGA (15×15) LFBGA package balances pin count and board area for space-constrained designs.
• RoHS Compliant: Conforms to common material and environmental regulations for broader manufacturability.

Why Choose XC7S50-2CSGA324I?

The XC7S50-2CSGA324I positions itself as an industrial-grade, compact FPGA solution that combines a substantial logic element count, meaningful embedded memory and a high I/O density in a single surface-mount package. Its voltage and temperature ratings support integration into systems requiring reliable, configurable digital logic across standard industrial environments.

This device is suited for engineers and procurement teams building embedded control, interface consolidation or custom logic acceleration solutions who require a balance of integration, predictable power requirements and a compact package footprint backed by AMD’s Spartan®-7 product family.

Request a quote or contact sales to inquire about availability, pricing and lead times for the XC7S50-2CSGA324I.