XC7S50-1FTGB196I

The XC7S50-1FTGB196I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC provided in a 196-LBGA package. It combines programmable logic capacity, embedded memory, and a 100-pin I/O count in an industrial-grade, surface-mount package.

Designed for applications that require on-chip logic, embedded RAM, and operation across an industrial temperature range, this device provides deterministic supply and thermal specifications to support reliable deployment in industrial environments.

Key Features

• Logic Capacity  Approximately 52,160 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 2.76 Mbits of on-chip RAM to store buffers, state machines, and lookup tables without external memory.
• I/O  100 user I/O pins to interface with sensors, peripherals, and external devices.
• Power Supply  Core voltage range specified from 0.950 V to 1.05 V for predictable power planning and system integration.
• Package & Mounting  Surface-mount 196-LBGA, Supplier Device Package: 196-CSBGA (15×15), enabling compact PCB integration.
• Industrial Grade & Temperature Range  Industrial grade device rated for operation from −40 °C to 100 °C for robust performance in demanding environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Programmable logic and 100 I/Os allow implementation of custom control, I/O conditioning, and protocol bridging within industrial systems operating across −40 °C to 100 °C.
• Embedded Processing  On-chip logic and approximately 2.76 Mbits of RAM support embedded state machines, data buffering, and deterministic processing tasks.
• Interface and Glue Logic  Dense logic resources and a broad I/O count enable consolidation of peripheral interfacing and glue logic into a single, surface-mount FPGA package.

Unique Advantages

• Significant Logic Density: 52,160 logic elements provide headroom to implement complex custom logic without multiple discrete devices.
• Integrated Memory: Approximately 2.76 Mbits of embedded RAM reduces the need for external memory for many buffering and LUT requirements.
• Industrial Qualification: Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
• Compact, Surface-Mount Packaging: 196-LBGA (15×15) package delivers a space-efficient footprint for high-density PCB designs.
• Defined Core Supply Range: 0.950–1.05 V core supply aids in predictable power delivery and thermal planning.
• RoHS Compliance: Environmentally compliant manufacturing for regulatory alignment.

Why Choose XC7S50-1FTGB196I?

The XC7S50-1FTGB196I positions itself as a compact, industrial-grade FPGA option that balances substantial on-chip logic and memory with a practical I/O count and a robust operating temperature range. Its defined core voltage and surface-mount 196-LBGA package make it suitable for designs that require integrated programmable logic in space-constrained, industrial applications.

This device is well suited to engineers and procurement teams seeking a RoHS-compliant FPGA with predictable electrical and thermal characteristics, on-chip resources for embedded functions, and a form factor compatible with modern PCB assembly.

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