XC7S50-1FTGB196C
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 2764800 52160 196-LBGA, CSPBGA |
|---|---|
| Quantity | 1,455 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSBGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-LBGA, CSPBGA | Number of I/O | 100 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4075 | Number of Logic Elements/Cells | 52160 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2764800 |
Overview of XC7S50-1FTGB196C – Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 2764800 52160 196-LBGA, CSPBGA
The XC7S50-1FTGB196C is a Spartan®-7 field programmable gate array offering a balance of programmable logic, embedded memory and I/O in a compact surface-mount package. It provides 52,160 logic elements and approximately 2.76 Mbits of on-chip RAM, together with 100 user I/O pins for implementing custom digital logic and interfacing tasks.
Targeted for commercial-grade applications, this device operates from a core supply range of 950 mV to 1.05 V and is rated for an operating temperature range of 0 °C to 85 °C, making it suitable for production designs that require a mid-density FPGA with RoHS compliance.
Key Features
- Core Logic Provides 52,160 logic elements to implement custom digital functions and control logic.
- Embedded Memory Approximately 2.76 Mbits of on-chip RAM for buffering, lookup tables and state storage.
- I/O Capacity 100 user I/O pins to support a variety of external interfaces and peripherals.
- Power Core voltage supply range of 950 mV to 1.05 V to match system power rails and designs that use low-voltage core domains.
- Package and Mounting 196-LBGA (196-CSBGA, 15 × 15) package in a surface-mount form factor for compact board layouts.
- Temperature and Grade Commercial grade operation from 0 °C to 85 °C for standard production environments.
- Compliance RoHS compliant for environmental regulatory adherence.
Typical Applications
- Custom Digital Logic Implement application-specific state machines, protocol handlers and glue logic using the device’s 52,160 logic elements and on-chip memory.
- Interface Bridging Use the 100 I/O pins to bridge between multiple peripherals or bus interfaces in compact system designs.
- Prototyping and Evaluation Suitable for evaluating mid-density FPGA implementations where a balance of logic, memory and I/O is required in a production-style package.
Unique Advantages
- Balanced Logic and Memory: 52,160 logic elements paired with approximately 2.76 Mbits of embedded RAM provide a practical combination for moderate-complexity designs.
- Generous I/O Count: 100 user I/O pins allow flexible external connectivity without requiring larger, higher-cost packages.
- Compact Surface-Mount Package: 196-LBGA (15 × 15) footprint supports space-constrained PCBs and standard assembly processes.
- Low-Voltage Core Operation: Core supply range of 950 mV to 1.05 V enables integration with low-voltage system power domains.
- Commercial Temperature Range: Rated 0 °C to 85 °C for general production applications.
- Environmental Compliance: RoHS compliance supports regulatory and sustainability requirements.
Why Choose XC7S50-1FTGB196C?
The XC7S50-1FTGB196C delivers a practical mix of logic capacity, embedded memory and I/O in a compact 196-LBGA surface-mount package, suited to commercial production designs that need mid-range FPGA resources. Its specified core voltage range and operating temperature make it appropriate for systems that align with standard commercial operating conditions.
This device is a fit for designers seeking a mid-density FPGA solution that combines approximately 52k logic elements, roughly 2.76 Mbits of on-chip RAM and 100 I/O pins in a manufacturable package while maintaining RoHS compliance.
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Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








