XC7S50-1FGA484I

IC FPGA 250 I/O 484FBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 250 2764800 52160 484-BGA

Quantity 583 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O250Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7S50-1FGA484I – Spartan®-7 FPGA, 52,160 logic elements, ~2.76 Mbits RAM, 250 I/Os, 484-BGA

The XC7S50-1FGA484I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC supplied in a 484-BGA package. It provides 52,160 logic elements, approximately 2.76 Mbits of embedded memory, and 250 general-purpose I/O pins.

This device is offered in a 484-FPBGA (23×23) surface-mount package, operates from a 0.95 V to 1.05 V core supply, and is specified for an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Logic Resources  52,160 logic elements; device data also specifies 4,075 CLBs for configurable logic capacity.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM (2,764,800 bits) for local buffering and state storage.
  • I/O Count  250 user I/O pins to support multiple parallel interfaces and external connectivity.
  • Power  Core voltage support from 0.95 V to 1.05 V for the device core supply.
  • Package & Mounting  484-BGA in a 484-FPBGA (23×23) supplier package; surface-mount mounting type for high-density board designs.
  • Operating Temperature  Specified for −40 °C to 100 °C operation, suitable for industrial-grade temperature environments.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: 52,160 logic elements provide substantial on-chip logic resources for mid-range FPGA designs.
  • On-chip memory availability: Approximately 2.76 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
  • Generous I/O count: 250 I/Os enable integration of multiple parallel interfaces and peripherals directly to the FPGA.
  • Compact, industry-standard package: 484-FPBGA (23×23) delivers a high-density, surface-mount footprint for space-constrained PCBs.
  • Industrial temperature rating: −40 °C to 100 °C specification supports deployment in environments that require extended temperature capability.
  • Low-voltage core operation: 0.95 V to 1.05 V core supply supports designs targeting modern low-voltage FPGA power domains.

Why Choose XC7S50-1FGA484I?

The XC7S50-1FGA484I balances logic density, embedded memory, and I/O count within a compact 484-FPBGA package, making it suitable for designs that require significant on-chip resources while maintaining a small PCB footprint. Its industrial temperature range and RoHS compliance support deployment in temperature-challenging and environmentally conscious product designs.

Designed for engineers seeking a mid-range Spartan®-7 FPGA configuration, this device offers verifiable resource counts and package specifications to simplify component selection and system planning.

If you would like pricing, lead-time information, or to request a formal quote for the XC7S50-1FGA484I, submit an inquiry to discuss availability and ordering details.

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