XC7S25-L1FTGB196I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 1658880 23360 196-LBGA, CSPBGA |
|---|---|
| Quantity | 385 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-LBGA, CSPBGA | Number of I/O | 100 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1825 | Number of Logic Elements/Cells | 23360 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1658880 |
Overview of XC7S25-L1FTGB196I – Spartan®-7 Field Programmable Gate Array (FPGA) IC
The XC7S25-L1FTGB196I is an AMD Spartan®-7 field programmable gate array provided in a 196-LBGA/CSPBGA package for surface-mount integration. It offers a balance of programmable logic, on-chip memory and I/O capability targeted at industrial embedded applications.
With 23,360 logic elements and approximately 1.66 Mbits of embedded memory, this industrial-grade FPGA supports designs that require moderate logic capacity, compact packaging and operation across a wide supply and temperature range.
Key Features
- Programmable Logic Capacity — 23,360 logic elements for implementing custom digital logic and control functions.
- Embedded Memory — Approximately 1.66 Mbits (1,658,880 bits) of on-chip RAM to support buffering, state storage and local memory needs.
- I/O Count — 100 user I/O pins to interface with sensors, actuators, peripherals and external devices.
- Power Supply — Operates from a core voltage supply range of 920 mV to 980 mV, enabling integration into systems with tightly defined core voltage rails.
- Package and Mounting — 196-LBGA, CSPBGA package (196-CSBGA, 15×15) optimized for surface-mount assembly in space-constrained designs.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C for reliability in demanding environments.
- Regulatory Compliance — RoHS compliant, supporting lead-free assembly processes and regulatory requirements.
Typical Applications
- Industrial Control — Combines industrial-grade temperature rating and 100 I/O to support motor drives, PLC interfaces and factory automation control logic.
- Embedded Signal Processing — 23,360 logic elements and ~1.66 Mbits of embedded RAM enable on-device data processing, protocol handling and custom acceleration in embedded systems.
- Interface and I/O Aggregation — High I/O count and compact 196-LBGA package make the device suitable for consolidating multiple peripheral interfaces in space-constrained industrial modules.
Unique Advantages
- Compact, board-friendly package: 196-LBGA/CSPBGA in a 15×15 supplier footprint minimizes PCB area while supporting surface-mount assembly.
- Industrial operating range: −40°C to 100°C rating provides resilience for deployments in harsher environments.
- Balanced resources: A combination of 23,360 logic elements and approximately 1.66 Mbits of RAM supports diverse embedded workloads without oversizing the design.
- Controlled core supply range: 920–980 mV core voltage support aligns with systems that require narrowly specified power rails.
- RoHS compliance: Facilitates lead-free manufacturing and alignment with common environmental requirements.
Why Choose XC7S25-L1FTGB196I?
The XC7S25-L1FTGB196I positions itself as a practical, industrial-grade FPGA option for designers who need a moderate logic footprint, meaningful on-chip memory and a compact BGA package. Its combination of 23,360 logic elements, approximately 1.66 Mbits of embedded RAM and 100 I/O pins supports a range of embedded control and interface functions while meeting industrial temperature requirements.
This part is suited for engineering teams focused on robust, space-efficient designs that require predictable power and thermal margins. The Spartan‑7 family characteristics and RoHS compliance contribute to long-term manufacturability and integration into industrial platforms.
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