XC7S25-2FTGB196I

The XC7S25-2FTGB196I is a Spartan®-7 Field Programmable Gate Array (FPGA) from AMD, delivered in a 196-LBGA (CSPBGA) package. It provides 23,360 logic elements and approximately 1.66 Mbits of embedded memory, making it suitable for designs that require moderate on-chip logic and memory resources.

Designed for surface-mount assembly with a supplier device package of 196-CSBGA (15×15), this industrial-grade device operates over a wide supply range (950 mV to 1.05 V) and an extended temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  23,360 logic elements provide programmable resources for custom digital functions and moderate complexity designs.
• Embedded Memory  Approximately 1.66 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory in many use cases.
• I/O Count  100 user I/O pins for connecting peripherals, sensors, and external logic while maintaining a compact footprint.
• Power  Operates from a core supply range of 950 mV to 1.05 V, allowing predictable power budgeting for the FPGA core.
• Package and Mounting  Available in a 196-LBGA (196-CSBGA, 15×15) package for surface-mount PCB designs, supporting compact board layouts.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, enabling deployment in environments requiring extended temperature tolerance.
• RoHS Compliant  Conforms to RoHS requirements for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial control systems  Industrial-grade temperature range and surface-mount packaging make the device applicable for control and monitoring equipment operating in extended environments.
• Embedded logic and custom processing  The combination of 23,360 logic elements and ~1.66 Mbits of on-chip RAM supports custom accelerators, glue logic, and moderate embedded processing tasks.
• I/O-centric designs  With 100 I/O pins, the device suits applications that require multiple sensor, peripheral, or interface connections while maintaining a compact package.

Unique Advantages

• Compact high-density package: 196-LBGA (196-CSBGA, 15×15) enables space-efficient board integration.
• Balanced logic and memory: 23,360 logic elements paired with ~1.66 Mbits of embedded RAM reduces the need for external memory in many designs.
• Extended environmental capability: Industrial grade and −40 °C to 100 °C operating range support deployment in demanding temperature conditions.
• Predictable core power envelope: Core supply range of 950 mV to 1.05 V assists in accurate power budgeting for system-level design.
• Surface-mount readiness: Surface-mount mounting type supports standard PCB assembly workflows for volume production.

Why Choose XC7S25-2FTGB196I?

The XC7S25-2FTGB196I brings together a practical balance of logic density, embedded memory, and I/O capacity in a compact 196-LBGA footprint, making it appropriate for engineers seeking a programmable solution with industrial temperature capability. Its supply voltage range and RoHS compliance provide predictable integration into modern, compliant hardware designs.

As a Spartan®-7 FPGA from AMD, this device is positioned for applications that need moderate on-chip resources, extended temperature operation, and a compact package form factor, delivering scalability and robustness for production-level embedded systems.

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