XC7S25-2CSGA324C

The XC7S25-2CSGA324C is a Spartan®-7 field programmable gate array (FPGA) IC from AMD offered in a 324-LFBGA package. It provides a combination of configurable logic, embedded memory, and a 150-pin I/O interface for commercial-grade embedded designs.

With 23,360 logic elements and approximately 1.66 Mbits of on-chip RAM, this device targets applications that require moderate logic density, substantial embedded memory, and a compact BGA footprint while operating across standard commercial temperature and supply ranges.

Key Features

• Configurable Logic  Provides 23,360 logic elements to implement custom digital functions and hardware-accelerated logic within a single device.
• Embedded Memory  Approximately 1.66 Mbits of on-chip RAM for buffering, state storage, and small data structures without external memory.
• I/O Capacity  150 general-purpose I/O pins to support a variety of interface requirements and peripheral connections.
• Power Domain  Core supply range of 0.95–1.05 V to match low-voltage system architectures.
• Package & Mounting  Supplied in a 324-LFBGA / 324-CSGA (15×15) package designed for surface-mount PCB assembly, enabling compact board layouts.
• Commercial Grade & Temperature  Commercial-grade device with an operating temperature range of 0 °C to 85 °C suitable for mainstream electronic applications.
• Environmental Compliance  RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Custom Digital Logic  Implement application-specific data paths, protocol handlers, and control logic using the device’s 23,360 logic elements.
• I/O-Intensive Interfaces  Support systems that require up to 150 I/O signals for sensor arrays, peripheral interfaces, or mixed-signal front-ends.
• On-Chip Buffering and Storage  Leverage approximately 1.66 Mbits of embedded RAM for packet buffering, FIFO storage, or small lookup tables without external memory.

Unique Advantages

• Moderate Logic Density: 23,360 logic elements enable substantial custom logic integration while keeping component count low.
• Integrated On-Chip Memory: Approximately 1.66 Mbits of RAM reduces reliance on external memory, simplifying board design and layout.
• Generous I/O Provisioning: 150 I/O pins accommodate complex system interfacing requirements without needing additional I/O expanders.
• Compact BGA Package: The 324-LFBGA / 324-CSGA (15×15) package supports high-density PCB designs and surface-mount assembly processes.
• Commercial Temperature & Compliance: Commercial-grade rating (0 °C to 85 °C) and RoHS compliance align with typical production and environmental expectations.
• Low-Voltage Core Compatibility: Core supply range of 0.95–1.05 V fits systems designed around low-voltage power rails.

Why Choose XC7S25-2CSGA324C?

The XC7S25-2CSGA324C balances configurable logic capacity, embedded memory, and I/O count in a compact surface-mount BGA package for commercial embedded systems. Its combination of 23,360 logic elements, approximately 1.66 Mbits of on-chip RAM, and 150 I/O pins makes it suitable for designs that require integrated digital processing and medium-scale interfacing without expanding the BOM.

For teams seeking a commercially rated, RoHS-compliant FPGA with a low-voltage core supply and a space-efficient 324-LFBGA footprint, the XC7S25-2CSGA324C provides a straightforward building block that supports medium-complexity custom logic solutions and streamlined board designs.

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