XC7S25-1FTGB196Q

The XC7S25-1FTGB196Q is a Spartan®-7 Field Programmable Gate Array (FPGA) from AMD designed for applications that require qualified, programmable logic in a compact, surface-mount package. It integrates 23,360 logic elements and approximately 1.66 Mbits of embedded RAM, supporting systems that need moderate logic density and on‑chip memory in a 196-LBGA (15×15) footprint.

Engineered with a 950 mV to 1.05 V supply range and an operating temperature span of –40 °C to 125 °C, this device carries AEC-Q100 qualification for automotive use and is intended for designs requiring automotive-grade programmable logic and robust thermal performance.

Key Features

• Logic Resources — 23,360 logic elements and 1,825 CLBs (configurable logic blocks) provide programmable fabric for custom digital functions and control logic.
• Embedded Memory — Approximately 1.66 Mbits of on-chip RAM to support buffers, FIFOs, small data stores, and intermediate processing without external memory.
• I/O Count — 100 user I/O pins to interface with sensors, actuators, and peripheral devices in embedded systems.
• Power Supply — Operates from a nominal 950 mV to 1.05 V core supply, suitable for low-voltage system designs.
• Automotive Qualification — AEC-Q100 qualification and an operating temperature range of –40 °C to 125 °C for automotive-ready deployments.
• Package & Mounting — 196-LBGA (15×15) CSPBGA package, designed for surface-mount assembly in space-constrained layouts.

Typical Applications

• Automotive Electronics — Qualified to AEC-Q100 and rated for –40 °C to 125 °C operation, suited for in-vehicle control, signal processing, and interface tasks that require programmable logic.
• High-Temperature Embedded Systems — The extended temperature range enables deployment in environments where thermal resilience is required.
• Compact, High-Density Designs — The 196-LBGA package and 100 I/O count support compact boards where board area and connector density are constrained.

Unique Advantages

• AEC-Q100 Qualified: Provides automotive-grade qualification for designs that require industry-standard reliability and screening.
• Balanced Logic and Memory: Combines 23,360 logic elements with approximately 1.66 Mbits of embedded RAM for integrated processing and buffering without immediate dependence on external memory.
• Wide Operating Temperature: Rated from –40 °C to 125 °C to support deployment in thermally demanding environments.
• Low-Voltage Core: 950 mV to 1.05 V supply support enables integration into modern low-voltage power domains.
• Compact Surface-Mount Package: 196-LBGA (15×15) CSPBGA package minimizes PCB footprint while offering robust connectivity through 100 I/O pins.

Why Choose XC7S25-1FTGB196Q?

The XC7S25-1FTGB196Q delivers a practical combination of programmable logic density, on-chip memory, and automotive-grade qualification in a compact surface-mount package. It suits developers and procurement teams looking for a qualified FPGA option that balances logic capacity, embedded RAM, and rugged thermal performance.

With its AEC-Q100 qualification, extended temperature range, and low-voltage operation, this Spartan®-7 device is positioned for long-term use in applications where reliability, compactness, and certified automotive readiness matter.

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