XC7S25-1FTGB196I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 1658880 23360 196-LBGA, CSPBGA |
|---|---|
| Quantity | 943 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-LBGA, CSPBGA | Number of I/O | 100 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1825 | Number of Logic Elements/Cells | 23360 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1658880 |
Overview of XC7S25-1FTGB196I – Spartan®-7 Field Programmable Gate Array (FPGA) IC, 100 I/Os, 196-LBGA
The XC7S25-1FTGB196I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 196-LBGA/CSPBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O count in a compact surface-mount form factor.
Key on‑device resources include 23,360 logic elements, approximately 1.66 Mbits of embedded RAM, and 100 I/Os. The device is specified for an industrial operating temperature range and a core voltage supply range of 950 mV to 1.05 V.
Key Features
- Logic Capacity Provides 23,360 logic elements for implementing programmable logic, state machines, and glue logic.
- Embedded Memory Approximately 1.66 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O 100 user I/Os to interface with peripherals, sensors, and external devices.
- Power Supply Core voltage supply specified from 950 mV to 1.05 V for direct compatibility with devices operating in that range.
- Package and Mounting Supplied in a 196-LBGA, CSPBGA package (supplier device package: 196-CSBGA, 15×15) with surface-mount mounting.
- Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS compliant.
Unique Advantages
- Compact BGA footprint: The 196-LBGA/CSPBGA package provides a high-density solution that minimizes board area while supporting robust I/O.
- Moderate on-chip memory: Approximately 1.66 Mbits of embedded RAM reduces the need for external memory in many buffering and control applications.
- Substantial logic resources: 23,360 logic elements enable implementation of complex control and interface functions within a single device.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-demanding environments.
- Tight core voltage window: The 950 mV–1.05 V supply range allows precise power budgeting and compatibility with systems designed around low-voltage cores.
- RoHS compliant: Conforms to environmental requirements for lead-free manufacturing processes.
Why Choose XC7S25-1FTGB196I?
The XC7S25-1FTGB196I delivers a practical combination of logic density, embedded memory, and I/O in a compact 196-LBGA/CSPBGA package from AMD’s Spartan‑7 family. Its specifications—23,360 logic elements, approximately 1.66 Mbits of on‑chip RAM, 100 I/Os, and an industrial −40 °C to 100 °C rating—make it appropriate for designs that require programmable logic with moderate memory and reliable operation over a wide temperature range.
Designed for surface-mount assembly and RoHS-compliant production, this FPGA offers a concise integration path for engineering teams seeking a vendor-backed programmable solution with defined electrical and thermal limits.
Request a quote or submit an inquiry to discuss pricing and availability for the XC7S25-1FTGB196I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








