XC7S25-1FTGB196I

IC FPGA 100 I/O 196CSBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 1658880 23360 196-LBGA, CSPBGA

Quantity 943 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case196-LBGA, CSPBGANumber of I/O100Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7S25-1FTGB196I – Spartan®-7 Field Programmable Gate Array (FPGA) IC, 100 I/Os, 196-LBGA

The XC7S25-1FTGB196I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 196-LBGA/CSPBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O count in a compact surface-mount form factor.

Key on‑device resources include 23,360 logic elements, approximately 1.66 Mbits of embedded RAM, and 100 I/Os. The device is specified for an industrial operating temperature range and a core voltage supply range of 950 mV to 1.05 V.

Key Features

  • Logic Capacity  Provides 23,360 logic elements for implementing programmable logic, state machines, and glue logic.
  • Embedded Memory  Approximately 1.66 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O  100 user I/Os to interface with peripherals, sensors, and external devices.
  • Power Supply  Core voltage supply specified from 950 mV to 1.05 V for direct compatibility with devices operating in that range.
  • Package and Mounting  Supplied in a 196-LBGA, CSPBGA package (supplier device package: 196-CSBGA, 15×15) with surface-mount mounting.
  • Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • Compact BGA footprint: The 196-LBGA/CSPBGA package provides a high-density solution that minimizes board area while supporting robust I/O.
  • Moderate on-chip memory: Approximately 1.66 Mbits of embedded RAM reduces the need for external memory in many buffering and control applications.
  • Substantial logic resources: 23,360 logic elements enable implementation of complex control and interface functions within a single device.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-demanding environments.
  • Tight core voltage window: The 950 mV–1.05 V supply range allows precise power budgeting and compatibility with systems designed around low-voltage cores.
  • RoHS compliant: Conforms to environmental requirements for lead-free manufacturing processes.

Why Choose XC7S25-1FTGB196I?

The XC7S25-1FTGB196I delivers a practical combination of logic density, embedded memory, and I/O in a compact 196-LBGA/CSPBGA package from AMD’s Spartan‑7 family. Its specifications—23,360 logic elements, approximately 1.66 Mbits of on‑chip RAM, 100 I/Os, and an industrial −40 °C to 100 °C rating—make it appropriate for designs that require programmable logic with moderate memory and reliable operation over a wide temperature range.

Designed for surface-mount assembly and RoHS-compliant production, this FPGA offers a concise integration path for engineering teams seeking a vendor-backed programmable solution with defined electrical and thermal limits.

Request a quote or submit an inquiry to discuss pricing and availability for the XC7S25-1FTGB196I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up