XC7S50-2FTGB196I

IC FPGA 100 I/O 196CSBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 2764800 52160 196-LBGA, CSPBGA

Quantity 1,254 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case196-LBGA, CSPBGANumber of I/O100Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7S50-2FTGB196I – Spartan®-7 Field Programmable Gate Array (FPGA) IC

The XC7S50-2FTGB196I is a Spartan®-7 Field Programmable Gate Array (FPGA) offered in a compact 196-LBGA / CSPBGA package. It delivers significant logic capacity and embedded memory in an industrial-grade, surface-mount form factor suitable for designs that require moderate programmable logic, on-chip RAM and flexible I/O.

Key attributes include 52,160 logic elements, approximately 2.76 Mbits of embedded memory, support for 100 user I/Os, and operation across a wide industrial temperature range, providing deterministic hardware resources for industrial and embedded applications.

Key Features

  • Core Logic  52,160 logic elements provide the programmable fabric needed for custom logic implementations and hardware acceleration.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM for data buffering, state machines and intermediate storage without external memory.
  • I/O Count  100 user I/Os support diverse peripheral connections and interface logic directly on the FPGA.
  • Power  Operates with a core supply range of 950 mV to 1.05 V, enabling integration into low-voltage power domains.
  • Package & Mounting  Available in a 196-LBGA (supplier package: 196-CSBGA, 15×15) surface-mount package for compact PCB integration.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: 52,160 logic elements enable complex hardware functions and parallel processing without external logic devices.
  • Substantial on-chip memory: Approximately 2.76 Mbits of embedded RAM reduces dependence on external memory for many designs, simplifying board layout.
  • Industrial operating range: Rated from −40 °C to 100 °C to support deployment in industrial and harsh ambient environments.
  • Compact, surface-mount package: 196-LBGA (15×15) package supports dense PCB designs while delivering a high pin count in a small footprint.
  • Low-voltage core operation: 950 mV to 1.05 V core supply fits modern low-voltage power architectures.
  • RoHS compliance: Conforms to common environmental requirements for modern electronics production.

Why Choose XC7S50-2FTGB196I?

The XC7S50-2FTGB196I is positioned for designs that require a balance of programmable logic density, embedded memory and a robust industrial operating range in a compact package. Its combination of 52,160 logic elements, approximately 2.76 Mbits of on-chip RAM and 100 I/Os delivers a self-contained platform for implementing custom digital logic, interface bridging and in-system processing while minimizing external components.

Choose this part when your project priorities include industrial temperature performance, compact LBGA packaging, and low-voltage core operation—providing a scalable, reliable hardware building block for embedded and industrial applications.

Request a quote or submit an inquiry to evaluate XC7S50-2FTGB196I for your next design and get pricing and availability details tailored to your requirements.

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