XC7S50-L1CSGA324I

IC FPGA 210 I/O 324FPGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 210 2764800 52160 324-LFBGA, CSPBGA

Quantity 118 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7S50-L1CSGA324I – Spartan®-7 FPGA, 210 I/Os

The XC7S50-L1CSGA324I is a Spartan®-7 field programmable gate array supplied in a 324-pin CSPBGA package. It combines a mid-range logic fabric with on-chip memory and a broad I/O count to support industrial embedded applications.

With 52,160 logic elements, approximately 2.76 Mbits of embedded memory and 210 user I/Os, this device targets designs that require configurable logic, deterministic I/O capacity and operation across an industrial temperature range.

Key Features

  • Logic Capacity  52,160 logic elements with 4,075 CLBs provide scalable programmable logic resources for custom digital functions.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM to support buffering, FIFOs and small data-storage needs directly in the FPGA fabric.
  • I/O  210 user I/O pins deliver flexible external interfacing for sensors, actuators, peripherals and bus connections.
  • Power  Specified core supply range of 920 mV to 980 mV for predictable power planning and supply design.
  • Package  324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact board-level integration.
  • Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
  • Standards Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

  • Industrial Control  Use the industrial-grade temperature rating and wide I/O count for motor control, PLC interfaces and factory automation logic.
  • Embedded Processing  Leverage the 52,160 logic elements and embedded RAM for custom signal processing, protocol handling or sensor aggregation.
  • Communication Interfaces  Deploy the 210 I/Os to implement parallel/serial interfaces, protocol bridging or custom I/O expansion on compact boards.

Unique Advantages

  • Balanced Logic and Memory:  52,160 logic elements combined with approximately 2.76 Mbits of RAM lets you implement both control and data-path functions on a single device.
  • Industrial Reliability:  Rated for −40 °C to 100 °C, the device is specified for demanding temperature environments common in industrial deployments.
  • Flexible I/O Count:  210 user I/Os provide ample connectivity for mixed-signal front ends, peripherals and high-pin-count interfaces.
  • Compact Board Integration:  The 324-CSPBGA (15×15) surface-mount package enables dense PCB layouts while maintaining required routing and thermal characteristics.
  • predictable power requirements:  A defined core voltage range (920–980 mV) simplifies power supply selection and thermal budgeting.
  • Regulatory Compliance:  RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose XC7S50-L1CSGA324I?

The XC7S50-L1CSGA324I positions itself as a practical, industrial-grade FPGA option for designers who need a mid-range logic device with substantial I/O capacity and embedded memory. Its combination of 52,160 logic elements, approximately 2.76 Mbits of on-chip RAM and 210 I/Os provides the resources required for control, interfacing and moderate signal-processing tasks within a compact 324-pin CSPBGA footprint.

This device is well suited for engineering teams focused on industrial and embedded applications that demand reliable operation across a wide temperature range, clear power requirements, and a compact package for dense PCB designs. The specification set supports scalable designs and straightforward integration into systems where programmability and on-board memory are critical.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for XC7S50-L1CSGA324I.

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