XC7S50-L1CSGA324I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 210 2764800 52160 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 118 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 210 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4075 | Number of Logic Elements/Cells | 52160 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2764800 |
Overview of XC7S50-L1CSGA324I – Spartan®-7 FPGA, 210 I/Os
The XC7S50-L1CSGA324I is a Spartan®-7 field programmable gate array supplied in a 324-pin CSPBGA package. It combines a mid-range logic fabric with on-chip memory and a broad I/O count to support industrial embedded applications.
With 52,160 logic elements, approximately 2.76 Mbits of embedded memory and 210 user I/Os, this device targets designs that require configurable logic, deterministic I/O capacity and operation across an industrial temperature range.
Key Features
- Logic Capacity 52,160 logic elements with 4,075 CLBs provide scalable programmable logic resources for custom digital functions.
- Embedded Memory Approximately 2.76 Mbits of on-chip RAM to support buffering, FIFOs and small data-storage needs directly in the FPGA fabric.
- I/O 210 user I/O pins deliver flexible external interfacing for sensors, actuators, peripherals and bus connections.
- Power Specified core supply range of 920 mV to 980 mV for predictable power planning and supply design.
- Package 324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact board-level integration.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
- Standards Compliance RoHS compliant to support regulatory and environmental requirements.
Typical Applications
- Industrial Control Use the industrial-grade temperature rating and wide I/O count for motor control, PLC interfaces and factory automation logic.
- Embedded Processing Leverage the 52,160 logic elements and embedded RAM for custom signal processing, protocol handling or sensor aggregation.
- Communication Interfaces Deploy the 210 I/Os to implement parallel/serial interfaces, protocol bridging or custom I/O expansion on compact boards.
Unique Advantages
- Balanced Logic and Memory: 52,160 logic elements combined with approximately 2.76 Mbits of RAM lets you implement both control and data-path functions on a single device.
- Industrial Reliability: Rated for −40 °C to 100 °C, the device is specified for demanding temperature environments common in industrial deployments.
- Flexible I/O Count: 210 user I/Os provide ample connectivity for mixed-signal front ends, peripherals and high-pin-count interfaces.
- Compact Board Integration: The 324-CSPBGA (15×15) surface-mount package enables dense PCB layouts while maintaining required routing and thermal characteristics.
- predictable power requirements: A defined core voltage range (920–980 mV) simplifies power supply selection and thermal budgeting.
- Regulatory Compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.
Why Choose XC7S50-L1CSGA324I?
The XC7S50-L1CSGA324I positions itself as a practical, industrial-grade FPGA option for designers who need a mid-range logic device with substantial I/O capacity and embedded memory. Its combination of 52,160 logic elements, approximately 2.76 Mbits of on-chip RAM and 210 I/Os provides the resources required for control, interfacing and moderate signal-processing tasks within a compact 324-pin CSPBGA footprint.
This device is well suited for engineering teams focused on industrial and embedded applications that demand reliable operation across a wide temperature range, clear power requirements, and a compact package for dense PCB designs. The specification set supports scalable designs and straightforward integration into systems where programmability and on-board memory are critical.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for XC7S50-L1CSGA324I.

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