XC7S50-L1FGGA484I

The XC7S50-L1FGGA484I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD designed for industrial-grade embedded applications. It combines a substantial logic capacity and on-chip memory with a high I/O count and a compact BGA package to support custom digital designs.

With an operating temperature range from −40 °C to 100 °C and a low-voltage core supply window, this device is suited for robust environments where compact integration and flexible logic implementation are required.

Key Features

• Core Logic  Approximately 52,160 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 2.76 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• I/O Capacity  Up to 250 I/O pins to connect multiple peripherals, sensors, and external interfaces directly to the FPGA fabric.
• Power Supply  Core voltage supply range of 920 mV to 980 mV to match low-voltage system architectures.
• Package & Mounting  484-ball FBGA (23 × 23) package in a surface-mount format for dense board layouts and high-pin-count integration.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in temperature-variable environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation, and real-time decision-making in industrial automation equipment within an industrial temperature envelope.
• Embedded Signal Handling  Perform on-chip buffering and logic processing using the device's embedded RAM and logic elements for custom signal path functions.
• I/O-Intensive Interfaces  Consolidate multiple sensors, actuators, or peripheral interfaces with the FPGA's 250 I/O pins to simplify board-level design.

Unique Advantages

• High Logic Density:  Approximately 52,160 logic elements provide considerable on-chip capacity for complex custom logic without immediate need for external CPLDs or microcontrollers.
• Embedded Memory Built In:  Around 2.76 Mbits of RAM reduces external memory requirements for buffering and state management.
• Robust Industrial Temperature Range:  Rated from −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Compact, High-Pin-Count Package:  The 484-FPBGA (23 × 23) package enables high I/O density in a space-efficient surface-mount form factor.
• Low-Voltage Core Compatibility:  Core supply range of 920 mV–980 mV aligns with low-voltage power architectures to help optimize system power design.
• RoHS Compliant:  Meets environmental requirements for restricted substances.

Why Choose XC7S50-L1FGGA484I?

The XC7S50-L1FGGA484I positions itself as a practical, industrial-grade FPGA option when significant logic capacity, embedded memory, and a high I/O count are required in a compact BGA package. Its combination of approximately 52,160 logic elements, ~2.76 Mbits of on-chip RAM, and 250 I/O pins supports a wide range of custom digital functions while maintaining board-space efficiency.

Designed and manufactured by AMD, this Spartan‑7 device is appropriate for engineers developing industrial embedded systems that demand flexible logic implementation, integrated memory, and operation across a wide temperature range. It delivers a balance of integration and ruggedness for medium-density FPGA applications.

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