XC7S6-1CPGA196Q
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 184320 6000 |
|---|---|
| Quantity | 734 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CPBGA (8x8) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | N/A | Number of I/O | 100 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 469 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 184320 |
Overview of XC7S6-1CPGA196Q – Spartan®-7 FPGA, 100 I/O, ~0.18 Mbit RAM, 6,000 Logic Elements
The XC7S6-1CPGA196Q is a Spartan®-7 field programmable gate array from AMD designed for mid-range, board-mounted applications. It provides 6,000 logic elements, approximately 0.18 Mbits of embedded memory, and 100 general-purpose I/O in a compact 196-CPBGA (8×8) surface-mount package. With an operating range down to −40 °C and up to 125 °C and AEC-Q100 qualification, this device targets applications that require reliable operation across wide temperature extremes.
Key Features
- Core Capacity — 6,000 logic elements suitable for mid-range programmable logic implementations.
- Embedded Memory — Approximately 0.18 Mbits (184,320 bits) of on-chip RAM for buffering, state storage, and small data structures.
- I/O Integration — 100 user I/O pins to support peripheral interfaces and board-level connectivity.
- Power — Core supply voltage range of 0.950 V to 1.05 V to support low-voltage system architectures.
- Package & Mounting — 196-CPBGA (8×8) supplier device package in a surface-mount form factor for compact PCB designs.
- Temperature & Qualification — Qualified to AEC-Q100 and specified for operation from −40 °C to 125 °C, addressing demanding thermal environments.
- Environmental Compliance — RoHS compliant to meet common environmental requirements.
Typical Applications
- Automotive Control Modules — AEC-Q100 qualification and a −40 °C to 125 °C operating range make the device suitable for vehicle electronics where board-mounted programmable logic is required.
- Embedded Low-Voltage Systems — The 0.950 V–1.05 V core supply and 100 I/O support compact embedded systems that prioritize low-voltage operation and flexible peripheral connectivity.
- Compact Board Designs — Surface-mount 196-CPBGA packaging and 100 I/O enable dense integration on space-constrained PCBs.
Unique Advantages
- AEC-Q100 Automotive Qualification: Certified to AEC-Q100 for applications that require automotive-level qualification and temperature resilience.
- Balanced Logic and Memory: 6,000 logic elements and approximately 0.18 Mbits of on-chip RAM provide a balanced resource set for mid-range programmable functions without excessive board-level components.
- Wide Operating Temperature: Specified operation from −40 °C to 125 °C supports deployment in thermally demanding environments.
- Low-Voltage Core: 0.950 V to 1.05 V core supply reduces power domain complexity for low-voltage systems.
- Compact Surface-Mount Package: 196-CPBGA (8×8) package enables high-density PCB layouts and simplified assembly.
- RoHS Compliant: Meets common environmental compliance requirements for modern electronics manufacturing.
Why Choose XC7S6-1CPGA196Q?
The XC7S6-1CPGA196Q delivers a mid-range FPGA option that combines 6,000 logic elements, approximately 0.18 Mbits of embedded RAM, and 100 I/O in a compact 196-CPBGA surface-mount package. Its 0.950 V–1.05 V core voltage and RoHS compliance make it suitable for modern low-voltage designs, while AEC-Q100 qualification and a −40 °C to 125 °C operating range address reliability needs for automotive and other temperature-challenging applications.
This device is well suited for designers seeking a compact, qualified FPGA for board-level integration where predictable thermal performance, moderate logic/memory resources, and extensive I/O are required.
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