XC7S6-1FTGB196C

The XC7S6-1FTGB196C is a Spartan®-7 FPGA packaged in a 196-LBGA (15×15) CSPBGA surface-mount package. It delivers a compact programmable logic solution with 6,000 logic elements and approximately 0.18 Mbits (184,320 bits) of on-chip RAM. Designed for commercial-grade applications, the device operates from a core supply range of 0.95 V to 1.05 V and across a 0 °C to 85 °C operating temperature range.

Key Features

• Core Logic — 6,000 logic elements and 469 CLBs provide the programmable fabric required for custom logic implementation and small to mid-sized FPGA designs.
• Embedded Memory — Approximately 0.18 Mbits (184,320 bits) of on-chip RAM for buffering, small LUT-based storage, and state retention within designs.
• I/O Capacity — 100 I/O pins to support peripheral interfacing and board-level connectivity in space-constrained designs.
• Power Supply — Core voltage support from 0.95 V to 1.05 V for designers targeting specific power envelopes and supply rails.
• Package and Mounting — 196-LBGA CSPBGA (196-CSBGA, 15×15) surface-mount package for compact PCB layouts and high-density integration.
• Temperature Grade — Commercial operating range from 0 °C to 85 °C, suitable for standard commercial applications.
• Environmental Compliance — RoHS-compliant device to meet common environmental directives.

Typical Applications

• Compact embedded logic — Designs that require a small FPGA footprint with 6,000 logic elements and on-chip RAM for control and glue logic functions.
• Interface bridging — Projects needing up to 100 I/Os to implement protocol conversion, signal aggregation, or peripheral interfacing within a single-package FPGA.
• Prototyping and development — Commercial-grade prototypes and evaluation platforms that operate within a 0 °C to 85 °C range and standard supply rails.

Unique Advantages

• Balanced logic and memory — 6,000 logic elements paired with ~0.18 Mbits of embedded RAM enables efficient implementation of control logic with local buffering.
• High I/O density — 100 available I/Os provide flexibility for mixed-signal interfacing, sensor connectivity, and board-level interconnect without adding external logic.
• Compact packaging — 196-LBGA (15×15) CSPBGA reduces PCB area and supports higher-density board designs.
• Predictable power window — Support for a defined core voltage range (0.95 V–1.05 V) helps designers target specific power architectures and regulator selections.
• Commercial readiness — RoHS compliance and a commercial temperature rating enable straightforward integration into mainstream electronics products.

Why Choose XC7S6-1FTGB196C?

The XC7S6-1FTGB196C offers a compact, programmable platform that balances logic capacity, embedded memory, and I/O count for commercial embedded designs. Its 196-LBGA package and surface-mount mounting style make it a practical choice where board area and integration density matter.

This device is well suited for engineers and procurement teams designing or sourcing commercial-grade FPGA solutions that require a defined supply voltage range and a standard operating temperature window. Its combination of logic, memory, and I/O provides a scalable option for small to medium complexity FPGA designs.

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