XC7S6-1FTGB196Q

The XC7S6-1FTGB196Q is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD designed for applications that require a mid-density, automotive-qualified programmable logic device. It provides 6,000 logic elements, embedded memory resources, and up to 100 I/O in a compact 196-LBGA (15×15) package.

With AEC-Q100 qualification and an extended operating temperature range, this device targets designs that demand automotive-grade reliability, deterministic I/O capacity, and low-voltage core operation.

Key Features

• Core Logic  Approximately 6,000 logic elements suitable for mid-density control, glue logic, and embedded connectivity functions.
• Embedded Memory  Approximately 0.18 Mbits of on-chip RAM (184,320 total RAM bits) to support buffering, state machines, and small data caches.
• I/O Count  100 user I/O pins to accommodate multiple peripheral interfaces, sensor lines, and control signals.
• Power  Low-voltage core operation with a supply range of 950 mV to 1.05 V for efficient power delivery and integration with modern power rails.
• Package & Mounting  196-LBGA (CSPBGA) surface-mount package with supplier device package 196-CSBGA (15×15) for space-constrained board designs.
• Temperature & Qualification  Automotive grade with AEC-Q100 qualification and an operating temperature range of –40 °C to 125 °C for use in harsh environments.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Automotive control systems  Engine, chassis, or body electronics that require an automotive-qualified FPGA with extended temperature capability and deterministic I/O.
• Sensor interfacing  Aggregation and preprocessing of signals from multiple sensors using available I/Os and on-chip memory for buffering.
• Motor control and actuation  Logic and timing functions for motor drivers and actuator control leveraging mid-density logic and low-voltage operation.
• Embedded glue logic  Custom protocol adaptation, timing conversion, and signal management between subsystems in constrained PCB space.

Unique Advantages

• Automotive-qualified reliability: AEC-Q100 qualification and –40 °C to 125 °C rating provide confidence for vehicle electronics and other harsh-environment applications.
• Mid-density integration: ~6,000 logic elements and on-chip memory reduce the need for discrete logic components, simplifying BOM and system design.
• Generous I/O count: 100 I/O pins enable flexible interfacing with sensors, actuators, and peripheral devices without extensive external multiplexing.
• Compact package: 196-LBGA (15×15) surface-mount footprint supports dense PCB layouts and space-constrained modules.
• Low-voltage core: 0.95–1.05 V supply range aligns with modern low-voltage power architectures for efficient integration.
• RoHS compliant: Meets environmental manufacturing requirements for contemporary production processes.

Why Choose XC7S6-1FTGB196Q?

The XC7S6-1FTGB196Q positions itself as a reliable, automotive-qualified mid-density FPGA option from AMD, combining approximately 6,000 logic elements, embedded memory, and 100 I/Os in a compact 196-LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for designs that must perform in demanding environments without sacrificing integration density.

This device is well suited for engineers developing automotive control modules, sensor aggregation nodes, or compact embedded systems that require deterministic I/O and moderate programmable logic capacity. Its combination of package size, low-voltage operation, and environmental compliance supports long-term production and deployment in temperature-challenging applications.

Request a quote or submit an inquiry to check availability and pricing for the XC7S6-1FTGB196Q for your next design.