XC7S6-1CSGA225I

The XC7S6-1CSGA225I is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD offered in a 225‑pin LFBGA / CSPBGA package. It delivers a balanced combination of logic capacity, on‑chip memory, and I/O in an industrial‑grade device designed for surface‑mount PCB integration.

With approximately 6,000 logic elements, 184,320 bits of on‑chip RAM, and 100 user I/O, this device suits applications that require moderate programmable logic, embedded memory, and a compact package footprint while operating within a 0.95–1.05 V core supply range and an industrial temperature window.

Key Features

• Core Logic  Approximately 6,000 logic elements and 469 logic blocks provide the device's programmable fabric for implementing custom logic and finite state machines.
• Embedded Memory  Approximately 0.18 Mbits (184,320 bits) of on‑chip RAM for local storage, buffering, and state retention without external memory.
• I/O  100 user I/O pins support interfacing with peripherals, sensors, and other system components.
• Power  Specified core voltage supply range of 0.95 V to 1.05 V for the device core.
• Package & Mounting  225‑LFBGA (225‑CSPBGA, 13×13) package in a surface‑mount form factor for compact board designs.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for extended environmental tolerance.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Right‑sized logic capacity: Approximately 6,000 logic elements and 469 logic blocks provide programmable resources for moderate-density FPGA designs without excess overhead.
• On‑chip memory availability: Approximately 0.18 Mbits of embedded RAM enables local data buffering and state retention without immediate dependence on external memory.
• Generous I/O for integration: 100 user I/O pins simplify direct interfacing to peripherals, sensors, and other digital domains.
• Industrial temperature rating: −40 °C to 100 °C operation and industrial grading support deployment in temperature‑challenging environments.
• Compact, surface‑mount package: 225‑LFBGA (225‑CSPBGA, 13×13) helps minimize board area while maintaining robust connectivity.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC7S6-1CSGA225I?

The XC7S6-1CSGA225I positions itself as an industrial‑grade Spartan®‑7 FPGA that balances programmable logic, embedded memory, and I/O capability in a compact surface‑mount package. Its specified core voltage range and extended operating temperature make it appropriate for designs that require stable operation across a broad set of environmental conditions.

This device is suitable for engineers and procurement teams looking for a vendor‑backed FPGA solution from AMD that provides moderate logic density, on‑chip RAM, and a robust package for integration into space‑constrained, industrial applications. The combination of package, I/O count, and environmental ratings supports long‑term design stability and predictable integration.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7S6-1CSGA225I Spartan®‑7 FPGA.