XC7S25-1CSGA225Q

The XC7S25-1CSGA225Q is a Spartan®-7 Field Programmable Gate Array (FPGA) packaged in a 225-LFBGA (225-CSPBGA, 13×13) surface-mount package. It provides 23,360 logic elements and approximately 1.66 Mbits of embedded memory, along with 150 user I/O pins.

Qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, this device is targeted at automotive and embedded applications that require programmable logic in a compact, surface-mount form factor with a low-voltage core range of 0.95–1.05 V.

Key Features

• Core Logic — 23,360 logic elements providing a mid-range programmable fabric suitable for a variety of implementation tasks.
• Embedded Memory — Approximately 1.66 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
• Programmable I/O — 150 I/O pins for flexible interfacing and external connectivity in compact systems.
• Package and Mounting — 225-LFBGA (225-CSPBGA, 13×13) surface-mount package for high-density board layouts.
• Power — Core voltage supply range of 0.95–1.05 V to match low-voltage system architectures.
• Temperature and Qualification — AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for demanding environments.
• Compliance — RoHS-compliant construction for regulatory and assembly compatibility.

Typical Applications

• Automotive Systems — Suitable for vehicle electronics where AEC‑Q100 qualification and wide temperature range are required for reliability and robustness.
• Embedded Control — Use for programmable control logic and timing functions in compact embedded systems benefitting from on-chip memory and plentiful I/O.
• I/O Expansion and Bridging — Acts as a flexible interface engine to bridge peripherals and sensors using its 150 I/O pins.

Unique Advantages

• Right-sized logic capacity: 23,360 logic elements deliver a balance of programmable resources for mid-complexity designs without unnecessary overhead.
• Automotive-qualified silicon: AEC‑Q100 qualification and −40 °C to 125 °C operating range support deployment in temperature-challenging automotive environments.
• Compact BGA package: 225-CSPBGA (13×13) surface-mount footprint simplifies board placement while enabling high I/O density.
• Generous I/O: 150 I/O pins provide flexibility for diverse peripheral and sensor connections.
• On-chip RAM: Approximately 1.66 Mbits of embedded memory reduces reliance on external RAM for many buffering and state storage needs.
• Tight core voltage window: 0.95–1.05 V support aligns with low-voltage system architectures and power delivery designs.

Why Choose XC7S25-1CSGA225Q?

The XC7S25-1CSGA225Q positions itself as a compact, automotive-qualified Spartan‑7 FPGA that combines mid-range logic capacity, embedded memory, and significant I/O in a 225-LFBGA surface-mount package. Its AEC‑Q100 qualification and wide temperature rating make it appropriate for designs requiring reliable, temperature-tolerant programmable logic.

This device is well suited for customers developing automotive and embedded applications that need a balance of integration, scalability, and robust qualification. With on-chip memory, a substantial logic element count, and a compact package, it supports streamlined BOMs and space-constrained board designs while providing long-term design stability through standardized qualification.

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