XC7S15-L1CSGA225I

IC FPGA 100 I/O 225CSBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 368640 12800 225-LFBGA, CSPBGA

Quantity 431 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case225-LFBGA, CSPBGANumber of I/O100Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells12800
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits368640

Overview of XC7S15-L1CSGA225I – Spartan®-7 Field Programmable Gate Array (FPGA) IC 100 368640 12800 225-LFBGA, CSPBGA

The XC7S15-L1CSGA225I is a Spartan®-7 Field Programmable Gate Array (FPGA) offered in a 225‑pin LFBGA / CSPBGA package. It provides a mid-range programmable logic resource set combining 12,800 logic elements, approximately 0.37 Mbits of embedded memory, and 100 general-purpose I/Os in a compact surface-mount footprint.

Designed as an industrial‑grade device, this FPGA supports a supply voltage window of 920 mV to 980 mV and an operating temperature range from −40 °C to 100 °C, making it suitable for embedded and industrial applications that require moderate logic density, integrated memory, and robust environmental performance.

Key Features

  • Core Logic 12,800 logic elements provide mid-density programmable logic for custom digital functions and glue logic.
  • Embedded Memory Approximately 0.37 Mbits of on-chip RAM for buffering, small FIFOs, and local data storage.
  • I/O Resources 100 general-purpose I/Os available for interfacing with external devices, sensors, and peripherals.
  • Power Operates from a specified supply voltage range of 920 mV to 980 mV, enabling defined power and timing design constraints.
  • Package & Mounting Supplied in a compact 225‑pin LFBGA/CSPBGA (225‑CSPBGA, 13 × 13 mm) surface-mount package for space-constrained designs.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet environmental requirements for industrial applications.
  • RoHS Compliant Device is RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • Industrial Control Implement custom control logic and I/O aggregation where industrial temperature range and 100 I/Os are required.
  • Embedded Systems Integrate moderate-density custom logic and on-chip memory in compact, surface-mount designs.
  • Interface Bridging Provide protocol conversion and signal conditioning using available I/O resources and programmable logic.
  • Prototyping and Development Validate mid-density logic designs and evaluate logic partitioning and timing within a 225‑LFBGA package.

Unique Advantages

  • Balanced Logic and Memory Combines 12,800 logic elements with approximately 0.37 Mbits of embedded RAM to support a range of mid-density designs without external memory for small buffers.
  • Compact Packaging 225‑pin CSPBGA package (13 × 13 mm) enables high functionality in space-constrained assemblies.
  • Industrial-Grade Operation −40 °C to 100 °C operating range provides robustness for industrial environments and extended temperature deployments.
  • Defined Power Envelope Narrow supply voltage window (920 mV–980 mV) supports consistent power budgeting and predictable timing design.
  • Simple BOM Impact On-chip RAM and ample I/Os reduce the need for some external components, simplifying board-level design.

Why Choose XC7S15-L1CSGA225I?

The XC7S15-L1CSGA225I positions itself as a practical, industrial‑grade FPGA choice for designs that require moderate logic capacity, integrated memory, and a substantial I/O count in a compact BGA package. Its combination of 12,800 logic elements, approximately 0.37 Mbits of embedded memory, and 100 I/Os supports a wide set of embedded and industrial control tasks while keeping board space and external component count low.

This part is suited to engineering teams and procurement groups seeking a reliable, RoHS‑compliant FPGA option with clearly defined electrical and thermal limits (920 mV–980 mV supply, −40 °C to 100 °C operation) and a compact surface‑mount package for production deployments.

Request a quote or submit a pricing and availability inquiry to receive product pricing, lead time, and ordering details for the XC7S15-L1CSGA225I.

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