XC7S15-L1FTGB196I

The XC7S15-L1FTGB196I is a Spartan®-7 Field Programmable Gate Array (FPGA) from AMD, offered in a 196‑LBGA (CSPBGA) package. It delivers a balance of programmable logic, embedded memory, and I/O density intended for industrial applications that require configurable logic and predictable thermal and voltage operating ranges.

Key Features

• Programmable Logic  Approximately 12,800 logic elements available for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.369 Mbits of on-chip RAM to support buffering, FIFOs, and small data tables.
• I/O Capacity  100 user I/O pins to interface with sensors, converters, memory devices, and external logic.
• Power Supply  Operates from a core supply in the range 920 mV to 980 mV, enabling integration with regulated power domains.
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C for use in industrial environments.
• Package and Mounting  196‑LBGA CSPBGA package (196‑CSBGA, 15 × 15 mm) with surface-mount assembly for compact PCB designs.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation, and real-time signal processing within industrial automation systems.
• Sensor and Data Acquisition  Aggregate and preprocess sensor data using available logic and embedded RAM before passing results to a host processor.
• Communication Interfaces  Provide protocol bridging, custom framing, or timing logic where moderate I/O counts and programmable logic are required.

Unique Advantages

• Right‑sized Logic Density: Approximately 12,800 logic elements offer a practical balance for mid‑complexity designs without excess cost or board area.
• Integrated Embedded Memory: On‑chip RAM (≈0.369 Mbits) reduces the need for small external SRAM/BRAM components for buffering and temporary storage.
• Industrial Temperature Range: Rated −40 °C to 100 °C to meet environmental requirements in many industrial deployments.
• Compact CSPBGA Package: 196‑LBGA (15 × 15 mm) package supports high component density and surface-mount assembly processes.
• Clear Power Envelope: Defined core supply range (920 mV–980 mV) helps simplify power sequencing and voltage regulation design.
• RoHS Compliant: Meets common lead‑free manufacturing requirements for global electronics production.

Why Choose XC7S15-L1FTGB196I?

The XC7S15-L1FTGB196I positions itself as a pragmatic FPGA choice for engineers needing configurable logic, embedded RAM, and moderate I/O in an industrial‑grade package. Its combination of approximately 12,800 logic elements, ~0.369 Mbits of on‑chip memory, and a 100‑pin I/O footprint fits a wide range of mid‑complexity control, interfacing, and signal‑processing tasks.

This device is suitable for designs that prioritize predictable operating ranges and compact board integration, supported by a CSPBGA 196 package and defined core voltage and temperature specifications. It offers scalability for teams leveraging programmable logic to reduce BOM complexity and consolidate discrete functions.

Request a quote or submit an inquiry to get pricing and availability information for XC7S15-L1FTGB196I and to discuss how it can fit your next industrial FPGA design.