XC7S25-1CSGA225I

IC FPGA 150 I/O 225CSGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 225-LFBGA, CSPBGA

Quantity 618 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case225-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7S25-1CSGA225I – Spartan®-7 FPGA, 150 I/O, 23,360 logic elements, 225‑LFBGA

The XC7S25-1CSGA225I is a Spartan®-7 field programmable gate array (FPGA) offered in a 225‑LFBGA (13×13) package. It provides a balanced mix of programmable logic, embedded memory, and I/O density for industrial-grade embedded designs.

With 23,360 logic elements, approximately 1.66 Mbits of on-chip RAM, and 150 I/O pins, this device targets industrial and embedded applications that require reconfigurable logic within a compact surface-mount package. It supports a core supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Programmable Logic  23,360 logic elements and 1,825 CLBs provide the configurable fabric for custom digital functions and glue logic.
  • Embedded Memory  Approximately 1.66 Mbits of on-chip RAM supports buffering, LUT-based memory, and small data storage needs directly inside the FPGA.
  • I/O Density  150 I/O pins enable interfaces to sensors, peripherals, and external devices while keeping a compact board footprint.
  • Power  Core supply voltage range from 0.95 V to 1.05 V allows integration with standard low-voltage power rails for modern designs.
  • Package and Mounting  225‑LFBGA (13×13) package in a surface-mount form factor simplifies PCB assembly and is suitable for space-constrained boards.
  • Industrial Grade and Environmental  Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulated manufacturing environments.

Typical Applications

  • Industrial Control and Automation  Implement custom control logic, deterministic I/O handling, and local signal processing using the device’s logic resources and wide operating temperature range.
  • Embedded Systems  Integrate peripheral interfaces and application-specific accelerators within a compact 225‑LFBGA package for space-constrained embedded designs.
  • Communications and Networking  Use the available logic and I/O to implement protocol handling, packet processing, or interface bridging in communication equipment.
  • Sensor Interfacing and Motor Control  Leverage the I/O count and on-chip memory for signal conditioning, timing-critical control loops, and local buffering in sensor or motor-control systems.

Unique Advantages

  • Balanced Logic and Memory:  23,360 logic elements paired with approximately 1.66 Mbits of embedded RAM enable mid-range designs without external memory for many control and signal-processing tasks.
  • Industrial-Grade Operation:  Rated for −40 °C to 100 °C operation, suitable for demanding temperature environments encountered in industrial deployments.
  • Compact Surface-Mount Package:  225‑LFBGA (13×13) packaging delivers a small board footprint while offering 150 I/O for flexible system integration.
  • Low-Voltage Core:  Core supply range of 0.95 V to 1.05 V supports modern low-voltage power architectures, helping to optimize system power budgets.
  • RoHS Compliant:  Meets RoHS requirements for environmentally regulated manufacturing and assembly processes.

Why Choose XC7S25-1CSGA225I?

The XC7S25-1CSGA225I positions itself as a practical industrial-grade FPGA option that combines a substantial logic resource pool, embedded memory, and a generous I/O count within a compact 225‑LFBGA package. Its specified operating temperature range and RoHS compliance make it suitable for production environments that demand reliability and regulatory adherence.

This device is well suited for engineers building mid-range embedded systems, industrial controllers, and communications interfaces that require reconfigurable logic, local memory, and flexible I/O. Its combination of features supports scalable designs that can be adapted as application requirements evolve.

Request a quote or submit a pricing inquiry to learn about availability and lead times for the XC7S25-1CSGA225I.

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