LX2160XE71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 212 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2160X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCN5A002A1 NXP
Ethernet100Gbps (2)Graphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width16 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2160XE71826B – ARM Cortex-A72 16-Core 1.8 GHz Microprocessor

The LX2160XE71826B is an NXP Layerscape LX2160X-series 64-bit microprocessor featuring sixteen ARM® Cortex®-A72 cores at 1.8 GHz in a 1517-FCPBGA (40×40) package. Designed for compute-intensive embedded networking and edge applications, it combines multi-core processing, high-speed SerDes and integrated I/O to deliver a compact, high-throughput solution for industrial and networking systems.

This industrial-qualified device pairs on-chip accelerators and rich connectivity with an extended operating temperature range (−40 °C to 105 °C) and RoHS compliance, enabling robust deployments in constrained power and board-space environments.

Key Features

  • Processor Cores  Sixteen ARM® Cortex®-A72 64‑bit cores running at 1.8 GHz for high parallel compute capacity.
  • Cache and Packet Buffer  Integrated 16 MB cache and a 2 MB packet caching buffer to reduce external memory traffic and lower latency.
  • Memory  Dual DDR4 controllers (2 × DDR4 72b) with ECC support, supporting rates up to 3200 MT/s and up to 256 GB system capacity.
  • High-speed SerDes  Up to 24 SerDes lanes operating to 25 GHz for flexible high-bandwidth I/O topologies.
  • Ethernet & Switching  Dual 100 Gbit/s Ethernet ports, up to 16 Ethernet ports supported, and an integrated 122 Gbit/s Layer‑2 switch for wire-rate networking.
  • Security & Offload  Secure Boot and Arm TrustZone® plus a 50 Gbit/s security accelerator to offload cryptographic processing.
  • Storage & Peripheral I/O  Four SATA 3.0 ports, two USB 3.0 ports plus USB PHYs, SD/eMMC support, and up to 24 PCIe Gen3 lanes (supporting multiple x8/x4/x1 configurations).
  • Additional Interfaces  CAN (including FD optional), multiple I2C, DUART and other control interfaces for system integration.
  • Graphics Acceleration  Integrated graphics acceleration to support display or graphics preprocessing tasks.
  • Package & Environment  1517‑FCPBGA (40×40) surface‑mount package, industrial qualification, RoHS compliant, and rated for −40 °C to 105 °C operation.

Typical Applications

  • Edge and Gateway Networking  Control-plane and data-plane processing for top-of-rack and edge switches where high Ethernet throughput and integrated switching are required.
  • Data Center Offload  Network interface and offload functions such as IPsec/compression acceleration and PCIe-connected NICs for server or appliance designs.
  • 5G Packet Processing  Packet and control processing in C-RAN and O-RAN elements that require multi-core compute and cryptographic offload.
  • Industrial Compute Platforms  High-performance industrial controllers and gateways benefiting from industrial qualification, extended temperature range, and rich I/O.

Unique Advantages

  • High Parallelism: Sixteen 64‑bit Cortex‑A72 cores provide scalable multi-threaded performance for concurrent network and control tasks.
  • Integrated Networking Fabric: Dual 100 Gbit/s Ethernet ports, multi-port support and a 122 Gbit/s L2 switch reduce external components and simplify board design.
  • On‑chip Offload Engines: Dedicated security and compression accelerators (50 Gbit/s security, 100 Gbit/s compression/decompression) lower CPU load and increase throughput.
  • Flexible High‑Speed I/O: Up to 24 SerDes lanes and up to 24 PCIe Gen3 lanes enable high-bandwidth connectivity to NICs, FPGAs and high-speed peripherals.
  • Memory and Latency Optimization: Dual DDR4 72b controllers with ECC and large on-chip cache/packet buffer minimize external memory usage and reduce latency.
  • Industrial Robustness: Surface-mount 1517‑FCPBGA package, industrial qualification and −40 °C to 105 °C operating range support harsh-environment deployments.

Why Choose LX2160XE71826B?

The LX2160XE71826B positions itself as a highly integrated, multi-core processor tailored for compute-intensive networking and edge applications. By combining sixteen Cortex‑A72 cores with substantial on‑chip cache, packet buffering, high-speed SerDes and dedicated offload engines, it enables compact designs that deliver high throughput with reduced external BOM.

This device is suited to designers building industrial-grade routers, switches, edge compute appliances and 5G packet-processing platforms that require scalable compute, robust security features and a wide range of high-speed I/O options. Its industrial qualification and extended temperature range provide long-term robustness for deployed systems.

Request a quote or submit an inquiry to receive pricing and availability information for LX2160XE71826B and to discuss how it fits into your next embedded networking or edge compute design.

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