LX2160XC71826B

The LX2160XC71826B from NXP Semiconductors is a high-performance, highly integrated microprocessor IC based on sixteen ARM® Cortex®-A72 64-bit cores running at 1.8 GHz. It targets compute-intensive embedded and networking applications that require multi-core processing, high-throughput I/O and hardware-accelerated security and compression.

Engineered for demanding networking, edge and industrial use cases, the device combines multi-core CPU performance with integrated DDR4 memory controllers, dual 100 Gbit/s Ethernet capability, hardware security features and a broad set of interfaces to minimize external components and simplify system design.

Key Features

• CPU  Sixteen ARM® Cortex®-A72 64-bit cores at 1.8 GHz delivering scalable multi-threaded application processing.
• Memory  Integrated DDR4 memory controllers; datasheet references 2× DDR4 72‑bit with ECC support up to 3200 MT/s and large memory capacity options.
• Networking & SerDes  High-speed I/O with dual 100 Gbit/s Ethernet ports and multiple integrated MACs. Series datasheet notes 24 SerDes lanes operating to 25 GHz and an integrated Layer‑2 switch for wire‑rate packet handling.
• Security & Acceleration  On‑chip security features including Secure Boot and Arm TrustZone®, plus a hardware security accelerator and compression/decompression engines referenced in the datasheet for offload of cryptographic and data‑plane tasks.
• Interfaces & Storage  Rich I/O including USB 3.0 (2 + PHY 2), up to 4× SATA 3.0 ports, CANbus and multiple peripheral buses; datasheet also references up to 24 PCIe Gen3 lanes for high‑speed host connectivity.
• Graphics & Packet Caching  Graphics acceleration is indicated and the series includes on‑chip packet caching to reduce external memory traffic and lower system latency.
• Package & Mounting  Supplied in a 1517‑FCPBGA (40×40) FCBGA package for surface mount assembly, suitable for compact board designs.
• Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 105 °C; RoHS compliant.

Typical Applications

• High‑performance Networking  Control and data‑plane processing in switches, routers and white‑box systems leveraging multi‑core processing and integrated 100 Gbit/s Ethernet.
• Data Center Offload  Host packet processing, IPsec/compression offload and NIC control where integrated security and high PCIe bandwidth reduce system load.
• 5G Packet Processing  Packet and control‑plane tasks in C‑RAN, CU/DU and base station equipment that require low‑latency processing and high throughput.
• Industrial & Edge Processing  Edge compute and gateway platforms that benefit from DDR4 memory, robust I/O and industrial temperature qualification.
• Autonomous & Sensor Systems  L2–L4 compute tasks, sensor aggregation and central connectivity roles where multi‑core compute and secure boot are required.

Unique Advantages

• High core density: Sixteen 64‑bit Cortex‑A72 cores provide parallel processing capacity for multi‑threaded networking and edge workloads.
• Integrated high‑speed I/O: Dual 100 Gbit/s Ethernet capability, multiple MACs and SerDes lanes reduce the need for external PHYs and switches.
• Hardware offload engines: On‑chip security and compression accelerators enable line‑rate processing while freeing CPU cycles for applications.
• Memory scalability: DDR4 controllers with ECC support and large addressable memory enable robust packet buffering and application memory footprints.
• Industrial readiness: Surface mount FCBGA package, industrial qualification and −40 °C to 105 °C operating range support deployment in constrained and harsh environments.

Why Choose LX2160XC71826B?

The LX2160XC71826B positions itself as a scalable, highly integrated processor for embedded networking and edge systems that demand multi‑core performance, high I/O throughput and hardware acceleration for security and compression. Its combination of sixteen ARM® Cortex®‑A72 cores, DDR4 memory support, dual 100 Gbit/s Ethernet capability and industrial operating range makes it suitable for designs that require consolidated compute and networking functionality in a single device.

Designed by NXP Semiconductors and supported by Layerscape software resources referenced in the series datasheet, this part is aimed at teams building data‑plane/networking, 5G packet processing, edge compute and industrial platforms where long‑term support, integration density and proven silicon features are important.

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