LX2160SN71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 839 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2160S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCN3A991A2
Ethernet100Gbps (2)Graphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width16 Core, 64-BitOperating Temperature0°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2160SN71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA

The LX2160SN71826B is a high‑performance 64‑bit microprocessor IC from NXP Semiconductors' Layerscape LX2160S series. It integrates sixteen ARM® Cortex®‑A72 cores at a rated speed of 1.8 GHz and is targeted at compute‑intensive embedded networking and edge processing applications.

Designed for systems requiring high I/O bandwidth and on‑chip acceleration, the device combines multi‑core processing, DDR4 memory controllers, integrated Ethernet and storage interfaces, and hardware security features to deliver a compact, efficient SoC building block for networking, edge compute, and industrial designs.

Key Features

  • CPU Core  Sixteen ARM® Cortex®‑A72 64‑bit cores delivering symmetrical multi‑core processing at 1.8 GHz for parallel compute workloads.
  • Memory Subsystem  Dual DDR4 memory controllers with ECC support; datasheet series detail includes support for high‑speed DDR4 up to 3200 MT/s and large total system memory capacity.
  • High‑Speed SerDes & Ethernet  Integrated high‑speed SerDes lanes and dual 100 Gbit/s Ethernet capability (2× 100GbE) for bandwidth‑intensive packet processing and networking I/O.
  • Storage & USB  On‑chip interfaces include four SATA 3.0 ports and two USB 3.0 ports plus PHY support, enabling direct attachment of storage and host peripherals.
  • Security  Hardware security features include Secure Boot and Arm TrustZone® to enable platform trust and secure boot chains.
  • Acceleration Engines  Series datasheet describes integrated security and compression accelerators capable of multi‑Gbps offload to reduce CPU load for encryption and compression tasks.
  • System Interfaces  Rich peripheral mix includes CANbus, multiple I2C, DUART, SD/eMMC and up to 24 PCIe Gen3 lanes (series capability), enabling flexible system expansion and connectivity.
  • Package & Thermal  1517‑FCPBGA (40×40) surface‑mount package; operating temperature range 0 °C to 105 °C. RoHS compliant.

Typical Applications

  • Network & Telecom Equipment  Control and data‑plane processing in switches, routers, and network appliances that need multi‑core compute and 100 Gbit/s Ethernet connectivity.
  • Data Center Offload  Compute offload functions and appliance controllers that leverage hardware security and compression accelerators to reduce host CPU load.
  • 5G Packet Processing  Edge and baseband‑adjacent packet processing in 5G infrastructure where high throughput and low latency are required.
  • Industrial & Edge Compute  Edge processing hubs and industrial controllers that require integrated interfaces, multi‑core processing and secure boot capabilities.
  • Autonomous Systems  L2–L4 compute tasks and sensor data aggregation in systems where onboard packet caching and deterministic I/O are important.

Unique Advantages

  • Multi‑core throughput: Sixteen ARM® Cortex®‑A72 cores provide parallel processing headroom for heavy network and compute tasks.
  • Integrated high‑speed I/O: Dual 100 Gbit/s Ethernet support, multiple SATA ports and USB 3.0 reduce external controller requirements and simplify board design.
  • On‑chip acceleration: Hardware security and compression accelerators offload compute‑intensive tasks to improve overall system efficiency.
  • Robust memory support: Dual DDR4 controllers with ECC capability and high supported data rates enable large memory footprints and reliable operation for data‑plane workloads.
  • Security foundation: Secure Boot and Arm TrustZone® enable stronger platform trust models for secure deployments.
  • Compact surface‑mount package: 1517‑FCPBGA (40×40) package allows high integration in constrained board space while supporting thermal requirements up to 105 °C.

Why Choose LX2160SN71826B?

The LX2160SN71826B brings multi‑core Armv8 processing, extensive high‑speed I/O and hardware acceleration together in a single, surface‑mount package—making it well suited for embedded networking, edge compute and industrial applications that demand throughput, integration and secure operation. Its combination of DDR4 memory support, dual 100 GbE capability and on‑chip accelerators enables system designers to reduce external components while maintaining high performance.

Backed by NXP Layerscape software support and the Layerscape ecosystem detailed in the product datasheet, this device offers a scalable platform for designs that require longevity and ongoing software tooling for complex networking and compute deployments.

Request a quote or submit an inquiry to receive pricing, availability and board‑level support information for the LX2160SN71826B.

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