LX2160SE71826B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 1,421 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2160S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | 5A002A1 NXP | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 16 Core, 64-Bit | Operating Temperature | 0°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 1.8GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2160SE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA
The LX2160SE71826B from NXP Semiconductors is a 16-core, 64-bit ARM® Cortex®-A72 microprocessor in a 1517-FCPBGA (40×40) package, specified at 1.8 GHz. It integrates high-performance processing, packet handling and rich I/O to address compute-intensive networking, data-center offload, 5G and edge/industrial applications where high throughput and system integration are required.
Designed for surface-mount board integration and RoHS compliance, this device combines multi-core compute, DDR4 memory support and advanced connectivity to simplify system design and lower total BOM for complex embedded platforms.
Key Features
- Core and Architecture Sixteen ARM® Cortex®-A72 64-bit cores operating at 1.8 GHz, delivering multi-threaded compute capacity for control-plane and data-plane workloads.
- Memory Subsystem DDR4 memory controllers with support for high-capacity DRAM; datasheet-level features include dual 72-bit DDR4 with ECC capability and large on-chip caching to reduce external memory usage.
- High-speed Serial and Packet I/O Integrated SerDes and multi-gigabit Ethernet capability including two 100 Gbps Ethernet ports (up to 100 Gbit/s support) and support for multiple Ethernet port speeds for flexible system topologies.
- Accelerators and Offload Hardware security features including Secure Boot and Arm TrustZone® are supported; the family-level documentation also describes dedicated security and compression offload engines to reduce CPU load.
- Peripheral and Storage Interfaces Rich connectivity including SATA 3.0 (4 ports), USB 3.0 (2 ports + PHY), CANbus, SD/eMMC, I2C and DUART for broad peripheral support.
- System Integration and IO Fabric Multiple PCIe Gen3 lanes and an integrated Layer‑2 switching capability are documented for high-throughput PCIe and switching topologies.
- Package and Environmental 1517-BBGA / 1517-FCPBGA package (40×40), surface-mount mounting, RoHS compliant and rated for operation from 0 °C to 105 °C.
- Graphics and Multimedia Graphics acceleration capability is indicated for offloading display or media tasks from the CPU cores.
Typical Applications
- Network Routing and Switching High-throughput control-plane and data-plane processing for top-of-rack, edge and white-box switch designs leveraging multiple Ethernet ports and integrated switching functions.
- Data Center Offload Offloading tasks such as secure tunnels, compression and packet processing to hardware accelerators to free CPU cycles for higher-level control and orchestration.
- 5G Packet Processing Packet and control processing for 5G infrastructure where multi-core performance and high-speed I/O are required.
- Industrial and Edge Compute Edge gateways and industrial control systems that need consolidated compute, DDR4 memory support and diverse peripheral connectivity including CANbus and SATA storage.
Unique Advantages
- Multi-core compute density: Sixteen Cortex‑A72 cores provide substantial parallel processing capacity for mixed control and data workloads.
- Integrated high-speed I/O: On-chip support for 100 Gbps Ethernet (two ports), multi‑lane SerDes and extensive peripheral interfaces reduces external bridge logic and BOM.
- Memory and caching strategy: DDR4 support with ECC capability and on-chip caching reduce external memory bandwidth requirements and improve latency for packet processing.
- Security and offload: Secure Boot and TrustZone® plus documented hardware offload engines lower CPU overhead for encryption and compression tasks.
- Production-ready packaging: 1517-FCPBGA surface-mount package and a 0 °C to 105 °C operating range simplify thermal and mechanical design for embedded systems.
Why Choose LX2160SE71826B?
The LX2160SE71826B positions itself as a highly integrated processing node for systems that demand multi-core performance, extensive I/O and built-in security. Its combination of 16 ARM Cortex‑A72 cores, DDR4 memory interfaces and high-speed Ethernet connectivity makes it suitable for network appliances, edge compute platforms and data-center offload functions where throughput and integration matter.
Choosing this device lets designers consolidate functions, reduce external components and rely on documented accelerator features and system-level interfaces to shorten development time and simplify system architecture.
Request a quote or submit an inquiry to receive pricing, availability and technical support for the LX2160SE71826B. Our team can provide lead-time, volume pricing and integration guidance to help you move from evaluation to production.

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