LX2160SE71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 1,421 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2160S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCN5A002A1 NXP
Ethernet100Gbps (2)Graphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width16 Core, 64-BitOperating Temperature0°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2160SE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA

The LX2160SE71826B from NXP Semiconductors is a 16-core, 64-bit ARM® Cortex®-A72 microprocessor in a 1517-FCPBGA (40×40) package, specified at 1.8 GHz. It integrates high-performance processing, packet handling and rich I/O to address compute-intensive networking, data-center offload, 5G and edge/industrial applications where high throughput and system integration are required.

Designed for surface-mount board integration and RoHS compliance, this device combines multi-core compute, DDR4 memory support and advanced connectivity to simplify system design and lower total BOM for complex embedded platforms.

Key Features

  • Core and Architecture Sixteen ARM® Cortex®-A72 64-bit cores operating at 1.8 GHz, delivering multi-threaded compute capacity for control-plane and data-plane workloads.
  • Memory Subsystem DDR4 memory controllers with support for high-capacity DRAM; datasheet-level features include dual 72-bit DDR4 with ECC capability and large on-chip caching to reduce external memory usage.
  • High-speed Serial and Packet I/O Integrated SerDes and multi-gigabit Ethernet capability including two 100 Gbps Ethernet ports (up to 100 Gbit/s support) and support for multiple Ethernet port speeds for flexible system topologies.
  • Accelerators and Offload Hardware security features including Secure Boot and Arm TrustZone® are supported; the family-level documentation also describes dedicated security and compression offload engines to reduce CPU load.
  • Peripheral and Storage Interfaces Rich connectivity including SATA 3.0 (4 ports), USB 3.0 (2 ports + PHY), CANbus, SD/eMMC, I2C and DUART for broad peripheral support.
  • System Integration and IO Fabric Multiple PCIe Gen3 lanes and an integrated Layer‑2 switching capability are documented for high-throughput PCIe and switching topologies.
  • Package and Environmental 1517-BBGA / 1517-FCPBGA package (40×40), surface-mount mounting, RoHS compliant and rated for operation from 0 °C to 105 °C.
  • Graphics and Multimedia Graphics acceleration capability is indicated for offloading display or media tasks from the CPU cores.

Typical Applications

  • Network Routing and Switching High-throughput control-plane and data-plane processing for top-of-rack, edge and white-box switch designs leveraging multiple Ethernet ports and integrated switching functions.
  • Data Center Offload Offloading tasks such as secure tunnels, compression and packet processing to hardware accelerators to free CPU cycles for higher-level control and orchestration.
  • 5G Packet Processing Packet and control processing for 5G infrastructure where multi-core performance and high-speed I/O are required.
  • Industrial and Edge Compute Edge gateways and industrial control systems that need consolidated compute, DDR4 memory support and diverse peripheral connectivity including CANbus and SATA storage.

Unique Advantages

  • Multi-core compute density: Sixteen Cortex‑A72 cores provide substantial parallel processing capacity for mixed control and data workloads.
  • Integrated high-speed I/O: On-chip support for 100 Gbps Ethernet (two ports), multi‑lane SerDes and extensive peripheral interfaces reduces external bridge logic and BOM.
  • Memory and caching strategy: DDR4 support with ECC capability and on-chip caching reduce external memory bandwidth requirements and improve latency for packet processing.
  • Security and offload: Secure Boot and TrustZone® plus documented hardware offload engines lower CPU overhead for encryption and compression tasks.
  • Production-ready packaging: 1517-FCPBGA surface-mount package and a 0 °C to 105 °C operating range simplify thermal and mechanical design for embedded systems.

Why Choose LX2160SE71826B?

The LX2160SE71826B positions itself as a highly integrated processing node for systems that demand multi-core performance, extensive I/O and built-in security. Its combination of 16 ARM Cortex‑A72 cores, DDR4 memory interfaces and high-speed Ethernet connectivity makes it suitable for network appliances, edge compute platforms and data-center offload functions where throughput and integration matter.

Choosing this device lets designers consolidate functions, reduce external components and rely on documented accelerator features and system-level interfaces to shorten development time and simplify system architecture.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the LX2160SE71826B. Our team can provide lead-time, volume pricing and integration guidance to help you move from evaluation to production.

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