LX2160CC72232B

The LX2160CC72232B is a high-performance Layerscape microprocessor based on 16 64-bit Arm® v8 Cortex®-A72 CPU cores running up to 2.2 GHz. It integrates high-bandwidth I/O, on-chip packet caching and dedicated accelerators to address compute‑intensive networking, data center offload, 5G and edge processing applications.

Designed for dense system integration, the device combines multi‑lane SerDes, multi‑100G Ethernet capability and security/compression offloads to deliver scalable throughput, reduced external memory dependency and a compact system BOM.

Key Features

• CPU Cores  Sixteen Arm v8 Cortex‑A72 cores, up to 2.2 GHz for multi‑threaded networking and control-plane workloads.
• Memory and Cache  16 MB cache with support for 2 × DDR4 (72b including ECC) to 3200 MT/s and up to 256 GB total capacity; includes a 2 MB on‑chip packet caching buffer.
• High‑Speed SerDes  24 SerDes lanes operating up to 25 GHz to support high‑speed link aggregation and PHY connectivity.
• Ethernet and Switching  Integrated support for up to 16 Ethernet ports and supported speeds from 1 Gbit/s to 100 Gbit/s, plus a 122 Gbit/s Layer‑2 switch and dual 100 Gbit Ethernet ports.
• Security & Compression Accelerators  50 Gbit/s security accelerator and 100 Gbit/s compression/decompression engine to offload cryptographic and data reduction tasks from CPU cores.
• PCIe and Storage  Up to 24 PCIe Gen3 lanes (supporting six ports as wide as x8) and 4 × SATA 3.0 interfaces for storage and expansion.
• Peripheral Interfaces  USB 3.0 (2) plus PHY (2), 2 × DUART, 8 × I²C, SD/eMMC and CANbus support to handle broad system I/O requirements.
• Graphics & System Offloads  Graphics acceleration and a dedicated wire‑rate I/O processor with integrated MACs to assist packet processing and system-level tasks.
• Package & Mounting  1517‑FCPBGA (40×40) FCBGA package, surface‑mount for compact board designs.
• Operating Range & Compliance  Operating temperature −40 °C to 105 °C and RoHS compliant.

Typical Applications

• Autonomous Driving  L2–L4 compute engine, sensor data management and central connectivity hub functions enabled by multi‑core processing and integrated I/O.
• White‑Box Switching  Control‑plane and host VM support for top‑of‑rack or edge switch platforms with 25 GE/100 GE port capability and IPsec offload.
• Data‑Center Offload  Use as a control or offload processor for NICs and appliance designs leveraging PCIe, high‑speed Ethernet and security/compression accelerators.
• 5G Packet Processing  Centralized or distributed unit packet processing, including PDCP/transport and IPsec offload, supported by high I/O bandwidth and hardware accelerators.

Unique Advantages

• High Core Density: Sixteen 64‑bit Cortex‑A72 cores at up to 2.2 GHz provide substantial parallel compute for control and data‑plane tasks.
• Integrated Network Throughput: Dual 100 Gbit Ethernet capability, a 122 Gbit/s L2 switch and multi‑rate port support reduce external switching and PHY complexity.
• On‑Chip Packet Caching: A 2 MB packet caching buffer minimizes external memory use for lower latency and smaller system footprint.
• Dedicated Offloads: Security (50 Gbit/s) and compression/decompression (100 Gbit/s) engines free CPU cycles for application logic and increase overall throughput.
• Broad I/O Ecosystem: Extensive SerDes, PCIe, SATA, USB, CAN and serial interfaces enable versatile system architectures and expansion options.
• Industrial Temperature Range & RoHS: −40 °C to 105 °C operating range with RoHS compliance for deployment in demanding environments.

Why Choose LX2160CC72232B?

The LX2160CC72232B positions itself as a highly integrated processor for networking and edge compute designs that require multi‑core performance, rich I/O and hardware offloads. Its combination of 16 Cortex‑A72 cores, extensive SerDes lanes, high‑rate Ethernet support and dedicated security/compression accelerators delivers a balanced platform for latency‑sensitive and throughput‑intensive applications.

Supported by on‑chip packet caching, robust memory options and a compact FCBGA package, the device targets designs that value integration, scalability and long‑term supply continuity. Software support options for the Layerscape family are available to help accelerate development and system bring‑up.

Request a quote or submit an RFQ to obtain pricing, lead‑time and availability details, and to discuss technical requirements with our team.