LX2122RN82029B

The LX2122RN82029B is a 12-core, 64-bit ARM® Cortex®-A72 microprocessor IC running at 2 GHz in a 1150-FBGA (23×23) surface-mount package. It targets compute-intensive embedded and networking applications where multi-core processing, high memory bandwidth and extensive I/O are required.

Designed for embedded and networking market segments, the device combines a high-performance Cortex‑A72 core cluster with on-chip memory controller support and a broad set of interfaces to simplify system integration and accelerate time-to-market.

Key Features

• CPU Cores 12 ARM® Cortex®-A72 cores, 64‑bit architecture running at 2 GHz, providing multi-core compute capability for parallel workloads.
• Memory Support Integrated controllers for DDR4 and SDRAM to support high-throughput system memory configurations.
• High‑Speed Storage and USB Four SATA 6 Gbps ports and one USB 3.0 port provide native high-speed storage and host connectivity.
• Package and Mounting 1150-FBGA supplier device package (23×23 mm), surface mount, optimized for compact board layouts.
• Automotive-grade I/O (CAN) CANbus interface(s) included for robust vehicle or industrial control network integration.
• Operating Range Specified operating temperature range of 5 °C to 105 °C suitable for a wide range of embedded environments.
• RoHS Compliant Device is RoHS compliant, supporting environmental and regulatory requirements.
• Layerscape Family Capabilities (from datasheet) Family-level features include on-chip packet caching, security and compression offload engines, multi-rate Ethernet and high-speed SerDes and PCIe connectivity to support networking and data-plane workloads.

Typical Applications

• Network Appliances Control and data-plane processing for routers, switches and gateway devices requiring multi-core packet handling and high I/O density.
• Data Center Offload Offloading compute-intensive networking tasks and accelerating security or compression functions in edge or appliance-class systems.
• 5G Infrastructure Packet and control-plane processing in 5G network elements where multi-core throughput and low-latency I/O are needed.
• Industrial Systems Embedded controllers and connectivity hubs that benefit from robust temperature range, CANbus integration and multiple storage/interface options.

Unique Advantages

• Multi‑Core Performance: 12 Cortex‑A72 cores at 2 GHz deliver parallel processing capacity for demanding embedded and networking workloads.
• Rich I/O Integration: Native SATA, USB3.0 and CANbus interfaces reduce external controller requirements and simplify BOM.
• Memory Bandwidth: DDR4 memory controller support enables high-throughput system memory configurations for data‑intensive applications.
• Compact, Surface‑Mount Package: 1150‑FBGA (23×23) package offers a concentrated feature set in a small board footprint.
• Extended Operating Range: 5 °C to 105 °C rating supports deployment in a wide range of embedded and industrial environments.
• Proven Software Ecosystem: Layerscape family software support (Linux SDK and CodeWarrior tools referenced in family datasheet) helps accelerate development and bring-up.

Why Choose LX2122RN82029B?

The LX2122RN82029B positions itself as a high-performance, highly integrated microprocessor for embedded networking and compute‑intensive applications. With a 12‑core ARM Cortex‑A72 cluster, DDR4 memory support, multiple high‑speed storage and peripheral interfaces, and a compact 1150‑FBGA package, it is well suited for designers seeking a scalable processing platform with broad I/O.

Its combination of multi-core compute, memory bandwidth and family-level Layerscape capabilities helps reduce system complexity and accelerate development for OEMs and system integrators building network appliances, edge compute units, 5G elements and industrial controllers.

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