LX2120XN72029B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 1,804 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 12 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2120XN72029B – IC MPU QORLQ LX2 2GHZ 1517FCPBGA
The LX2120XN72029B is a 12-core, 64-bit microprocessor IC based on the ARM® Cortex®-A72 architecture, running at 2 GHz and packaged in a 1517 FCPBGA (40×40) surface-mount package. It targets embedded and industrial networking and compute applications that require multi-core processing, high-speed I/O and industrial temperature operation.
Designed for integration into high-performance embedded platforms, this device combines a multi-core Cortex‑A72 processor cluster with DDR4 memory support, dual 100 Gbps Ethernet capability, multiple high-speed peripheral interfaces and hardware security features such as Secure Boot and Arm TrustZone®.
Key Features
- Core & Architecture 12 ARM® Cortex®-A72 cores, 64-bit, operating at up to 2 GHz for multi-threaded embedded workloads.
- Memory & Storage DDR4 memory controller support and four SATA 3.0 ports for high-bandwidth system memory and local storage connectivity.
- Networking & High-Speed I/O Dual 100 Gbps Ethernet capability, 2 × USB 3.0 plus PHY support, and additional high-speed serial interfaces including CANbus.
- Security Secure Boot and Arm TrustZone® provide foundational hardware-based security for trusted boot and secure partitioning.
- Graphics & Acceleration Integrated graphics acceleration to support display and accelerated graphics workloads.
- Package & Mounting 1517-FCPBGA (40×40) FCBGA package, surface mount, suitable for compact board designs.
- Operating Environment Industrial qualification with operating temperature range from −40 °C to 105 °C and RoHS compliance.
Typical Applications
- Networking Infrastructure — Control plane and data plane processing in routers, switches and white‑box network equipment leveraging multi-core compute and dual 100 Gbps Ethernet connectivity.
- Data Center Offload — Offloading control and management tasks in NICs and edge compute nodes where multi-core processing and high-speed I/O are required.
- 5G Packet Processing — Edge and packet-processing functions in 5G transport and aggregation equipment that need high throughput and secure boot capability.
- Industrial Edge Systems — Industrial gateways and control platforms benefiting from industrial temperature range, CANbus support and robust security features.
Unique Advantages
- High multi-core throughput: 12 Cortex‑A72 cores at up to 2 GHz enable parallel processing of networking and compute tasks.
- High-speed network connectivity: Dual 100 Gbps Ethernet ports provide the bandwidth needed for modern high-throughput network designs.
- Comprehensive I/O: Multiple SATA 3.0 ports, USB 3.0 interfaces with PHY support, and CANbus simplify system integration across storage, peripheral and field networks.
- Hardware security building blocks: Secure Boot and TrustZone® support create a foundation for secure system designs and partitioned software stacks.
- Industrial readiness: Wide operating temperature range (−40 °C to 105 °C) and surface‑mount FCBGA packaging support deployment in industrial environments.
Why Choose LX2120XN72029B?
The LX2120XN72029B positions itself as a highly integrated, industrial-grade multi-core processor for embedded networking and edge compute applications. Its combination of 12 Cortex‑A72 cores, DDR4 memory support, multiple high‑speed interfaces and hardware security features makes it suitable for designers who need performance, connectivity and industrial reliability in a compact FCBGA package.
Targeted at system architects building network infrastructure, edge compute nodes, 5G packet processors and industrial gateways, this device offers scalable compute and a familiar software ecosystem to accelerate development and deployment.
Request a quote or submit an inquiry to receive pricing, availability and integration support for the LX2120XN72029B. Our team can provide lead-time information and assistance to help you move from evaluation to production.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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