LX2120XN72232B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2.2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 828 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 12 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2.2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2120XN72232B – IC MPU QORLQ 2.2GHZ 1517FCPBGA
The LX2120XN72232B is a high‑performance QorIQ Layerscape microprocessor based on 64‑bit ARM® Cortex®‑A72 cores. This industrial‑qualified device integrates a 12‑core CPU cluster running at up to 2.2 GHz and a broad set of high‑speed I/O to address compute‑intensive embedded and networking applications.
Designed for edge, networking and industrial systems, the LX2120XN72232B delivers a combination of multi‑core processing, integrated memory controllers and multi‑100 Gbit/s networking capability to simplify system design and improve throughput and security.
Key Features
- Core & Architecture 12 × ARM® Cortex®‑A72 64‑bit cores running up to 2.2 GHz for multi‑threaded, compute‑intensive workloads.
- Memory Integrated DDR4 memory controllers for high bandwidth system memory.
- Networking & Packet Processing Dual 100 Gbit/s Ethernet capability and architecture drawn from the Layerscape family to support high‑ throughputs in networking applications.
- Storage & I/O Four SATA 3.0 ports and two USB 3.0 ports (plus two PHYs) provide flexible storage and peripheral connectivity.
- Interfaces Additional interfaces including CANbus for industrial connectivity and broad peripheral support.
- Security Secure Boot and Arm TrustZone® technologies for hardware‑anchored platform security.
- Package & Mounting 1517‑FCPBGA (40 × 40 mm) surface‑mount package for compact board integration.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
- RoHS Compliance RoHS‑compliant device suitable for modern environmental requirements.
Typical Applications
- Network Appliances — Control and data‑plane processors for routers, switches and network appliances requiring multi‑100 Gbit/s connectivity.
- Edge and Data‑Center Offload — Edge compute and offload functions that benefit from high core counts and integrated I/O.
- 5G and Telecom Infrastructure — Packet processing and control functions in 5G radio and core network elements.
- Industrial Control — Industrial systems and gateways that require secure, rugged processing with CAN and SATA connectivity.
- Autonomous Systems — Vehicle and robotics control where deterministic multi‑core processing and secure boot are required.
Unique Advantages
- High‑density multi‑core processing: Twelve Cortex‑A72 cores at up to 2.2 GHz deliver scalable compute for parallel workloads and multi‑VM environments.
- Multi‑100 Gbit/s networking capability: Dual 100 Gbit/s Ethernet support enables high aggregate throughput for networking and edge data paths.
- Rich, integrated I/O: Built‑in DDR4 controllers, SATA3.0, USB3.0 and CANbus reduce external components and simplify board design.
- Platform security: Secure Boot and TrustZone® provide a hardware foundation for secure system boot and trusted execution.
- Industrial readiness: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh environments.
- Compact package: 1517‑FCPBGA (40 × 40 mm) surface‑mount package enables dense board layouts while supporting extensive I/O.
Why Choose LX2120XN72232B?
The LX2120XN72232B combines multi‑core 64‑bit ARM® Cortex®‑A72 performance with a broad set of integrated memory and high‑speed I/O to deliver a balanced platform for networking, edge compute and industrial systems. Its industrial qualification, security features and compact BGA package make it suitable for applications that require robust operation and strong throughput in constrained board spaces.
Backed by Layerscape family software support and ecosystem tools, this device provides a scalable, long‑term foundation for designs that demand high performance, integrated connectivity and platform security.
Request a quote or submit your design requirements to receive pricing and availability for the LX2120XN72232B. Our team can provide lead‑time and ordering details to help move your project forward.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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