LX2120XE72029B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 586 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 12 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2120XE72029B – ARM Cortex-A72 12-Core 2 GHz Microprocessor
The LX2120XE72029B is an NXP Semiconductors Layerscape LX2120X series embedded microprocessor based on 64-bit ARM® Cortex®-A72 cores. This device integrates a 12-core compute cluster running at 2 GHz and is targeted at compute‑intensive embedded networking and industrial applications that require high throughput, hardware security, and broad I/O integration.
With DDR4 memory controllers, multi‑100 Gbps networking capability, SATA and USB connectivity, and industrial qualification and temperature range, the LX2120XE72029B is designed to consolidate control and data‑plane functions in space‑ and power‑constrained systems.
Key Features
- CPU Cores 12× ARM® Cortex®-A72 64‑bit cores running up to 2 GHz for multi‑threaded embedded processing.
- Memory DDR4 memory controller support for system memory integration and high bandwidth data buffering.
- Ethernet Dual 100 Gbps Ethernet capability to support high‑speed networking and data‑plane throughput.
- Storage Interfaces Four SATA 3.0 ports for native high‑speed storage connectivity.
- USB & PHY Two USB 3.0 ports plus two USB PHY lanes for host and peripheral connectivity.
- Additional I/O CANbus support and other peripheral interfaces suitable for embedded control and connectivity.
- Security Secure Boot and Arm TrustZone® support to enable platform integrity and trusted execution.
- Graphics Graphics acceleration supported for display or media‑offload tasks.
- Package & Mounting 1517‑FCPBGA (40×40) FCBGA package, surface mount.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of -40 °C to 105 °C.
- RoHS Compliance Environmentally compliant (RoHS).
Typical Applications
- Network Infrastructure Control and data‑plane processing for routers, switches, and edge appliances leveraging high‑speed Ethernet.
- Data Center Offload Compute offload and packet processing tasks where integrated high bandwidth I/O and security acceleration reduce external subsystem requirements.
- 5G and Telecom Packet processing and control functions for 5G infrastructure components that require multi‑core compute and robust I/O.
- Industrial Systems Embedded controllers and connectivity hubs that benefit from industrial qualification, CANbus, and extended temperature operation.
Unique Advantages
- High multi‑core throughput: Twelve 64‑bit Cortex‑A72 cores at 2 GHz provide parallel processing headroom for multi‑threaded networking and control workloads.
- Integrated high‑speed I/O: Dual 100 Gbps Ethernet plus SATA and USB3.0 connectivity reduce external bridging and simplify board design.
- Security built in: Secure Boot and TrustZone® help establish platform trust and protect software stacks from the boot sequence onward.
- Industrial readiness: Industrial qualification and -40 °C to 105 °C operation support deployment in harsh and temperature‑variable environments.
- Compact, manufacturable package: 1517‑FCPBGA (40×40) surface‑mount package streamlines assembly for space‑constrained systems.
- Vendor ecosystem: Part of the Layerscape LX2120X family from NXP, enabling access to documented processor features and ecosystem resources.
Why Choose LX2120XE72029B?
The LX2120XE72029B combines a 12‑core ARM Cortex‑A72 compute cluster with broad, high‑speed I/O and hardware security features, making it a practical choice for embedded networking, telecom, and industrial designs that demand consolidated processing and connectivity. Its industrial qualification and extended temperature range support reliable operation in challenging environments.
Designed to simplify system architecture, this device reduces external component count through integrated interfaces and security, while providing a clear upgrade path within the Layerscape family for scalable performance and long‑term platform support.
Request a quote or contact sales to discuss availability, pricing, and integration support for the LX2120XE72029B.

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