LX2120XC72232B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2.2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 441 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 12 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2.2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2120XC72232B – IC MPU QORLQ 2.2GHZ 1517FCPBGA
The LX2120XC72232B is a high-performance microprocessor from NXP Semiconductors’ LX2120X series, featuring ARM® Cortex®-A72 cores in a 64-bit implementation running at 2.2 GHz. Designed for compute‑intensive embedded systems, the device combines multi‑core processing with a broad set of high‑speed I/O for networking, storage, and industrial applications.
This industrial‑qualified device offers integrated interfaces and security features to support robust, long‑lived designs across edge processing, communications equipment, data center offload, and industrial control environments.
Key Features
- Core & Performance ARM® Cortex®-A72 64‑bit architecture with a 12‑core configuration running at 2.2 GHz for multi‑threaded embedded workloads.
- Memory DDR4 memory controller support as specified for the product to meet high‑bandwidth application needs.
- Networking & High‑Speed I/O Dual 100 Gbps Ethernet capability (2 × 100GbE) for high‑throughput networking and packet processing.
- Storage & USB Four SATA 3.0 ports and two USB 3.0 ports plus two USB PHYs provide flexible local storage and peripheral connectivity.
- Security Hardware features including Secure Boot and Arm TrustZone® to support device integrity and platform security.
- Additional Interfaces CANbus support and graphics acceleration are provided for control networks and accelerated graphics tasks.
- Package & Mounting 1517‑FCPBGA supplier device package (40 × 40 mm), 1517‑BBGA / FCBGA family package style; surface‑mount device.
- Operating Range & Qualification Industrial qualification with operating temperature range from −40°C to 105°C and RoHS compliance.
Typical Applications
- Network Equipment High‑throughput routers, switches and packet processors leveraging the 12 cores and 100GbE ports for control and data plane tasks.
- Data Center Offload Hardware offload and control‑plane functions that require multi‑core processing and high‑speed Ethernet connectivity.
- 5G & Edge Packet Processing Edge and telecommunications functions that need sustained packet throughput and secure boot capabilities.
- Industrial Control Systems Industrial controllers and gateways that benefit from industrial qualification, extended temperature range, and CANbus connectivity.
Unique Advantages
- Multi‑core compute density: Twelve 64‑bit ARM® Cortex®‑A72 cores at 2.2 GHz provide parallel processing capacity for demanding embedded workloads.
- High‑bandwidth networking: Two 100 Gbps Ethernet interfaces enable native support for high‑speed network fabrics and backbone connectivity.
- Integrated storage and peripheral I/O: Four SATA 3.0 ports plus USB 3.0 and PHY support simplify system designs that require local storage and fast peripheral access.
- Platform security: Secure Boot and Arm TrustZone® support help establish a secure foundation for protected firmware and application deployment.
- Industrial readiness: Industrial qualification and a −40°C to 105°C operating range allow deployment in harsh and temperature‑sensitive environments.
- Compact BGA package: 1517‑FCPBGA (40 × 40 mm) surface‑mount package supports dense board integration for space‑constrained systems.
Why Choose LX2120XC72232B?
The LX2120XC72232B combines a 12‑core ARM® Cortex®‑A72 processor architecture with extensive high‑speed I/O and hardware security to deliver a balanced platform for embedded networking, edge computing, and industrial designs. Its industrial qualification and extended temperature range make it suitable for robust deployments where reliability and sustained performance matter.
Backed by NXP’s semiconductor ecosystem and software resources, the LX2120XC72232B is positioned for customers seeking a scalable, secure, and integrated MPU solution for mid‑to‑high performance embedded systems.
Request a quote or submit your requirements to receive pricing and availability for the LX2120XC72232B. Our team can provide lead‑time information and support for your design‑in evaluation.

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