LX2120XC72232B

IC MPU QORLQ 2.2GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2.2GHz 1517-FCPBGA (40x40)

Quantity 441 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width12 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed2.2GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2120XC72232B – IC MPU QORLQ 2.2GHZ 1517FCPBGA

The LX2120XC72232B is a high-performance microprocessor from NXP Semiconductors’ LX2120X series, featuring ARM® Cortex®-A72 cores in a 64-bit implementation running at 2.2 GHz. Designed for compute‑intensive embedded systems, the device combines multi‑core processing with a broad set of high‑speed I/O for networking, storage, and industrial applications.

This industrial‑qualified device offers integrated interfaces and security features to support robust, long‑lived designs across edge processing, communications equipment, data center offload, and industrial control environments.

Key Features

  • Core & Performance  ARM® Cortex®-A72 64‑bit architecture with a 12‑core configuration running at 2.2 GHz for multi‑threaded embedded workloads.
  • Memory  DDR4 memory controller support as specified for the product to meet high‑bandwidth application needs.
  • Networking & High‑Speed I/O  Dual 100 Gbps Ethernet capability (2 × 100GbE) for high‑throughput networking and packet processing.
  • Storage & USB  Four SATA 3.0 ports and two USB 3.0 ports plus two USB PHYs provide flexible local storage and peripheral connectivity.
  • Security  Hardware features including Secure Boot and Arm TrustZone® to support device integrity and platform security.
  • Additional Interfaces  CANbus support and graphics acceleration are provided for control networks and accelerated graphics tasks.
  • Package & Mounting  1517‑FCPBGA supplier device package (40 × 40 mm), 1517‑BBGA / FCBGA family package style; surface‑mount device.
  • Operating Range & Qualification  Industrial qualification with operating temperature range from −40°C to 105°C and RoHS compliance.

Typical Applications

  • Network Equipment  High‑throughput routers, switches and packet processors leveraging the 12 cores and 100GbE ports for control and data plane tasks.
  • Data Center Offload  Hardware offload and control‑plane functions that require multi‑core processing and high‑speed Ethernet connectivity.
  • 5G & Edge Packet Processing  Edge and telecommunications functions that need sustained packet throughput and secure boot capabilities.
  • Industrial Control Systems  Industrial controllers and gateways that benefit from industrial qualification, extended temperature range, and CANbus connectivity.

Unique Advantages

  • Multi‑core compute density: Twelve 64‑bit ARM® Cortex®‑A72 cores at 2.2 GHz provide parallel processing capacity for demanding embedded workloads.
  • High‑bandwidth networking: Two 100 Gbps Ethernet interfaces enable native support for high‑speed network fabrics and backbone connectivity.
  • Integrated storage and peripheral I/O: Four SATA 3.0 ports plus USB 3.0 and PHY support simplify system designs that require local storage and fast peripheral access.
  • Platform security: Secure Boot and Arm TrustZone® support help establish a secure foundation for protected firmware and application deployment.
  • Industrial readiness: Industrial qualification and a −40°C to 105°C operating range allow deployment in harsh and temperature‑sensitive environments.
  • Compact BGA package: 1517‑FCPBGA (40 × 40 mm) surface‑mount package supports dense board integration for space‑constrained systems.

Why Choose LX2120XC72232B?

The LX2120XC72232B combines a 12‑core ARM® Cortex®‑A72 processor architecture with extensive high‑speed I/O and hardware security to deliver a balanced platform for embedded networking, edge computing, and industrial designs. Its industrial qualification and extended temperature range make it suitable for robust deployments where reliability and sustained performance matter.

Backed by NXP’s semiconductor ecosystem and software resources, the LX2120XC72232B is positioned for customers seeking a scalable, secure, and integrated MPU solution for mid‑to‑high performance embedded systems.

Request a quote or submit your requirements to receive pricing and availability for the LX2120XC72232B. Our team can provide lead‑time information and support for your design‑in evaluation.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up