LX2120XC71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 186 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width12 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2120XC71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA

The LX2120XC71826B is an industrial-grade microprocessor featuring a 12-core, 64-bit ARM® Cortex®-A72 architecture running at 1.8 GHz. It targets compute-intensive embedded and networking applications that require multi-core processing, integrated high-speed I/O, and hardware security features.

With integrated DDR4 memory support, dual 100 Gbps Ethernet capability, multiple SATA and USB interfaces, and industrial temperature qualification, this device is designed to deliver high integration and reliable operation across demanding edge, networking, and industrial use cases.

Key Features

  • Core — 12-core ARM® Cortex®-A72 64-bit processor running at 1.8 GHz for parallel compute and control workloads.
  • Memory — DDR4 memory controller(s) for high-speed system memory interfacing.
  • Networking — Dual 100 Gbps Ethernet capability, enabling high-throughput network connectivity and packet processing.
  • Storage & USB — Four SATA 3.0 ports for storage connectivity and two USB 3.0 ports plus two USB PHYs for high-speed peripheral attachment.
  • Security — Secure Boot and Arm TrustZone® technologies for hardware-based platform security and trusted execution.
  • Additional Interfaces — CANbus support for industrial and vehicle-area network integration.
  • Graphics — Graphics acceleration included to offload visual processing tasks.
  • Package & Mounting — 1517-FCPBGA package (40×40 mm), surface-mount for compact board designs.
  • Qualification & Temperature — Industrial qualification with an operating temperature range of −40 °C to 105 °C for harsh environments.
  • Environmental — RoHS compliant.

Typical Applications

  • Network Infrastructure — Control-plane and data-plane processing in switches, routers, and edge network appliances using high-speed Ethernet and multi-core compute.
  • Edge and 5G — Edge compute and 5G packet processing where multi-core performance and high-throughput I/O are required.
  • Industrial Automation — Industrial controllers and gateways that require CANbus connectivity, rugged temperature operation, and long-term reliability.
  • Storage and NAS — Multi-bay storage appliances leveraging SATA 3.0 ports and high-throughput Ethernet for networked storage solutions.
  • Embedded Vision / Graphics Systems — Systems that benefit from on-chip graphics acceleration for visualization or HMI tasks.

Unique Advantages

  • Multi-core processing density: Twelve 64-bit Cortex-A72 cores at 1.8 GHz provide scalable compute for parallel workloads and complex packet or control-plane tasks.
  • High-speed I/O integration: Built-in dual 100 Gbps Ethernet, multiple SATA 3.0 ports, and USB 3.0 support reduce external interface components and simplify board design.
  • Industrial readiness: Industrial qualification and a −40 °C to 105 °C operating range enable deployment in harsh environmental conditions.
  • Hardware security features: Secure Boot and Arm TrustZone® provide a hardware-backed foundation for platform security and trusted execution environments.
  • Compact system footprint: 1517-FCPBGA (40×40 mm) surface-mount package supports dense board layouts while maintaining extensive I/O.
  • Standards-aligned connectivity: SATA 3.0, USB 3.0, CANbus, and high-speed Ethernet options support common embedded and networking ecosystems.

Why Choose LX2120XC71826B?

The LX2120XC71826B delivers a balanced combination of multi-core ARM® compute, high-speed networking, and broad peripheral integration in an industrial-qualified package. Its hardware security features and wide operating temperature range make it suitable for long-lived, reliable deployments in edge, networking, and industrial systems.

This device is well suited for designers who need scalable processing capability together with integrated Ethernet, storage, and peripheral interfaces to reduce BOM complexity and accelerate time-to-market while maintaining industrial robustness.

Request a quote or submit an inquiry to get pricing, availability, and technical support for the LX2120XC71826B. Our team can assist with lead times, sample requests, and integration guidance to help you evaluate this microprocessor for your next design.

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