LX2120SN72029B

IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2GHz 1517-FCPBGA (40x40)

Quantity 1,416 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width12 Core, 64-BitOperating Temperature0°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed2GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2120SN72029B – IC MPU QORLQ LX2 2GHZ 1517FCPBGA

The LX2120SN72029B is a 12-core, 64-bit ARM® Cortex®-A72 microprocessor in a 1517-FCPBGA (40×40) package, optimized for compute-intensive embedded networking and edge applications. Running at up to 2 GHz, this QorIQ Layerscape family device delivers multi-core processing, integrated I/O and security features to support high-throughput packet processing, data-plane control and edge compute tasks.

Designed for embedded and networking equipment in consumer-class applications, the device balances processing performance with high integration to reduce board complexity and accelerate time-to-market.

Key Features

  • Core Architecture ARM® Cortex®-A72 64-bit cores, 12-core configuration running up to 2 GHz for parallel compute workloads.
  • Memory Integrated DDR4 memory controllers to support high-performance system memory.
  • High‑Speed Ethernet Dual 100 Gbit/s Ethernet capability to support high-throughput networking and packet forwarding.
  • Storage Interfaces Four SATA 3.0 ports for direct-attached storage and high-speed local data access.
  • USB and PHY Two USB 3.0 ports plus two USB PHY interfaces for peripheral connectivity and host interfaces.
  • Additional I/O CANbus support for in-application control and communication; graphics acceleration for display or offload tasks.
  • Security Secure Boot and Arm TrustZone® technology to enable trusted boot and hardware-backed security domains.
  • Package & Mounting 1517‑FCPBGA (40×40) FCBGA package, surface mount for high-density board designs.
  • Operating Range & Qualification Operating temperature 0 °C to 105 °C and consumer qualification; RoHS compliant.

Typical Applications

  • Networking Equipment High-throughput routing, switching control plane and packet processing where dual 100 Gbit/s Ethernet and multi-core processing are required.
  • Data Center Offload Edge compute and data-plane acceleration tasks that benefit from many cores and integrated high-speed I/O.
  • 5G Infrastructure Packet processing and control functions in 5G infrastructure and edge deployments leveraging multi-core performance and secure boot capabilities.
  • Industrial Edge Embedded gateway and edge computing for industrial applications requiring robust I/O (SATA, CANbus, USB) and graphics acceleration.

Unique Advantages

  • High core count at 2 GHz: Enables parallel processing of packet, control and application workloads without external offload requirements.
  • Integrated high-speed I/O: Dual 100 Gbit/s Ethernet, SATA 3.0 and USB 3.0 reduce BOM and simplify board design for networking and edge systems.
  • Built-in security: Secure Boot and TrustZone® provide a hardware-rooted trust model for secure firmware and software execution.
  • Compact, surface-mount package: 1517‑FCPBGA (40×40) packaging supports dense board layouts while maintaining robust signal integrity.
  • Consumer-class temperature and compliance: 0 °C to 105 °C operating range with RoHS compliance for regulated markets.
  • Layerscape software ecosystem: Supported by Layerscape software resources for embedded Linux and development tools to accelerate software bring-up.

Why Choose LX2120SN72029B?

The LX2120SN72029B positions itself as a high-performance, highly integrated processor for embedded networking and edge compute designs. With a 12-core ARM Cortex-A72 architecture, dual 100 Gbit/s Ethernet capability, extensive storage and peripheral interfaces, and hardware security features, it is well suited for designs that require sustained packet throughput, secure boot, and compact board integration.

For developers and system integrators targeting consumer-class networking, data offload and edge infrastructure, this device offers a scalable software ecosystem and the core/peripheral mix needed to shorten development cycles while maintaining robust performance and integration.

Request a quote or submit a pricing and availability inquiry for the LX2120SN72029B to get started with volume pricing and lead-time information.

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